Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate

ABSTRACT

An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.

FIELD

This disclosure relates generally to manufacturing parts, and moreparticularly to systems and methods for manufacturing parts usingelectrochemical additive manufacturing techniques.

BACKGROUND

Electrochemical additive manufacturing utilizes electrochemicalreactions to manufacture parts in an additive manufacturing manner. Inan electrochemical additive manufacturing process, a metal part isconstructed by plating charged metal ions onto a surface of a cathode inan electrolyte solution. This technique relies on placing a depositionanode physically close to the cathode in the presence of a depositionsolution (the electrolyte), and energizing the anode causing charge toflow through the anode. This creates an electrochemical reductionreaction to occur at the cathode near the anode and deposition ofmaterial on the cathode. Although electrochemical additive manufacturingtechniques provide distinct advantages over other types of additivemanufacturing processes, such as selective laser melting and electronbeam melting, cathodes of conventional electrochemical additivemanufacturing systems are single-purpose cathodes.

SUMMARY

The subject matter of the present application has been developed inresponse to the present state of the art, and in particular, in responseto the shortcomings of conventional systems and methods for additivemanufacturing of parts, that have not yet been fully solved by currentlyavailable techniques. Accordingly, the subject matter of the presentapplication has been developed to provide systems and methods for theelectrochemical additive manufacturing of parts that overcome at leastsome of the above-discussed shortcomings of prior art techniques.

The following is a non-exhaustive list of examples, which may or may notbe claimed, of the subject matter, disclosed herein.

The following portion of this paragraph delineates example 1 of thesubject matter, disclosed herein. According to example 1, anelectrochemical additive manufacturing method is disclosed. The methodcomprises a step of positioning a conductive surface of a cathodeportion of a build plate into an electrolyte solution such that theconductive surface directly contacts the electrolyte solution. Themethod also comprises a step of positioning a deposition anode arrayinto the electrolyte solution such that a gap is defined between theconductive surface of the cathode portion and the deposition anode. Themethod additionally comprises a step of transmitting electrical energythrough the deposition anode. The method further comprises a step oftransmitting the electrical energy from the deposition anode, throughthe electrolyte solution, and to the conductive surface of the cathodeportion, such that material is deposited onto the conductive surface ofthe cathode portion. The build plate and the material deposited onto theconductive surface form at least a portion of a finished product (e.g.,component) having a particular functionality. The build plate at leastpartially enables the particular functionality.

The following portion of this paragraph delineates example 2 of thesubject matter, disclosed herein. According to example 2, whichencompasses example 1, above, the build plate comprises prefabricatedfeatures.

The following portion of this paragraph delineates example 3 of thesubject matter, disclosed herein. According to example 3, whichencompasses example 2, above, the prefabricated features are formed viaa process selected from the group consisting of casting, forging,rolling, cutting, grinding, and drilling.

The following portion of this paragraph delineates example 4 of thesubject matter, disclosed herein. According to example 4, whichencompasses any one of examples 1-3, above, the build plate comprises athermal feature configured to transfer heat, and the material depositedonto the conductive surface is thermally coupled with the thermalfeature to promote heat transfer by or to the thermal feature.

The following portion of this paragraph delineates example 5 of thesubject matter, disclosed herein. According to example 5, whichencompasses example 4, above, the material deposited onto the conductivesurface forms a heat wicking feature.

The following portion of this paragraph delineates example 6 of thesubject matter, disclosed herein. According to example 6, whichencompasses any one of examples 1-5, above, the build plate forms atleast a portion of a fluid channel.

The following portion of this paragraph delineates example 7 of thesubject matter, disclosed herein. According to example 7, whichencompasses example 6, above, the material deposited onto the conductivesurface forms a wicking feature inside the fluid channel.

The following portion of this paragraph delineates example 8 of thesubject matter, disclosed herein. According to example 8, whichencompasses any one of examples 1-7, above, the build plate comprises anon-conductive substrate, the cathode portion comprises a conductivelayer on a surface of the non-conductive substrate, and the conductivesurface is defined by the conductive layer.

The following portion of this paragraph delineates example 9 of thesubject matter, disclosed herein. According to example 9, whichencompasses example 8, above, the build plate, the cathode portion, andthe material deposited onto the conductive surface form an electronicsensor component.

The following portion of this paragraph delineates example 10 of thesubject matter, disclosed herein. According to example 10, whichencompasses example 9, above, the electronic sensor component comprisesat least one of a thermocouple or a strain gauge.

The following portion of this paragraph delineates example 11 of thesubject matter, disclosed herein. According to example 11, whichencompasses any one of examples 8-10, above, the material deposited ontothe conductive surface forms a surface mount technology (SMT) passivecomponent.

The following portion of this paragraph delineates example 12 of thesubject matter, disclosed herein. According to example 12, whichencompasses any one of examples 8-11, the conductive layer comprisescircuit traces, each forming part of the same electrical circuit or acorresponding one of multiple electrical circuits formed on or in thenon-conductive substrate.

The following portion of this paragraph delineates example 13 of thesubject matter, disclosed herein. According to example 13, whichencompasses example 12, above, the conductive layer comprises at leasttwo electrical terminals, spaced apart from each other, and the materialdeposited onto the conductive surface forms an electrical connectionthat electrically couples together the at least two electricalterminals.

The following portion of this paragraph delineates example 14 of thesubject matter, disclosed herein. According to example 14, whichencompasses any one of examples 12 or 13, above, the material depositedonto the conductive surface forms a radio-frequency (RF) component.

The following portion of this paragraph delineates example 15 of thesubject matter, disclosed herein. According to example 15, whichencompasses any one of examples 12-14, above, the method furthercomprises selectively connecting the circuit traces to an electricalpower source to cause the electrical energy to transmit through thedeposition anode array and from the deposition anode array to thecircuit traces, such that the material is deposited onto the circuittraces.

The following portion of this paragraph delineates example 16 of thesubject matter, disclosed herein. According to example 16, whichencompasses any one of examples 1-15, above, the build plate comprises aself-supporting structure, and the material deposited onto theconductive surface of the cathode portion forms a non-self-supportingstructure that is supported by the self-supporting structure.

The following portion of this paragraph delineates example 17 of thesubject matter, disclosed herein. According to example 17, whichencompasses any one of examples 1-16, above, the build plate comprisesan electronic component.

The following portion of this paragraph delineates example 18 of thesubject matter, disclosed herein. According to example 18, whichencompasses any one of examples 1-17, above, the build plate comprisesan excess material portion, and the method further comprises a step ofremoving at least a portion of the excess material portion of the buildplate after the material is deposited onto the conductive surface of thecathode portion.

The following portion of this paragraph delineates example 19 of thesubject matter, disclosed herein. According to example 19, whichencompasses any one of examples 1-18, above, the build plate comprises apre-used part comprising a worn portion from which worn material hasbeen removed, and the material, deposited onto the conductive surface,replaces the worn material.

The following portion of this paragraph delineates example 20 of thesubject matter, disclosed herein. According to example 20, anelectrochemical deposition system for fabricating a manufactured partcomprises an electrodeposition cell, configured to hold an electrolyticfluid. The system also comprises a build plate, comprisingcharacteristics that contribute to the functionality of the manufacturedpart. The characteristics comprise a cathode portion having a conductivesurface. The system also comprises a printhead, comprising a pluralityof deposition anodes positioned within the electrodeposition cell, amounting system, configured to position the cathode portion of the buildplate in the electrodeposition cell, an electrical power supply,configured to create a voltage potential on the cathode portion of thebuild plate, and a positioning system, configured to control a distancebetween the cathode portion of the build plate and the plurality ofdeposition anodes of the printhead. The system further comprises acontroller, configured to control a current field across the pluralityof deposition anodes, when the electrodeposition cell holds theelectrolytic fluid, to selectively deposit material onto the cathodeportion of the build plate. The material deposited onto the cathodeportion forms a portion of the manufactured part.

The following portion of this paragraph delineates example 21 of thesubject matter, disclosed herein. According to example 21, whichencompasses example 20, above, the build plate comprises prefabricatedfeatures.

The following portion of this paragraph delineates example 22 of thesubject matter, disclosed herein. According to example 22, whichencompasses example 21, above, the prefabricated features are formed viaa process selected from the group consisting of casting, forging,rolling, cutting, grinding, and drilling.

The following portion of this paragraph delineates example 23 of thesubject matter, disclosed herein. According to example 23, whichencompasses any one of examples 20-22, above, the build plate comprisesa thermal feature configured to transfer heat.

The following portion of this paragraph delineates example 24 of thesubject matter, disclosed herein. According to example 24, whichencompasses any one of examples 20-23, the build plate comprises aself-supporting structure.

The following portion of this paragraph delineates example 25 of thesubject matter, disclosed herein. According to example 25, whichencompasses any one of examples 20-24, the build plate comprises anon-conductive substrate, the cathode portion comprises a conductivelayer on a surface of the non-conductive substrate, and the conductivesurface is defined by the conductive layer.

The following portion of this paragraph delineates example 26 of thesubject matter, disclosed herein. According to example 26, whichencompasses any one of examples 20-25, the build plate comprises anelectronic component.

The following portion of this paragraph delineates example 27 of thesubject matter, disclosed herein. According to example 27, whichencompasses example 26, above, the build plate and the cathode portionform an electronic sensor component.

The following portion of this paragraph delineates example 28 of thesubject matter, disclosed herein. According to example 28, whichencompasses example 27, above, the electronic sensor component comprisesat least one of a thermocouple or a strain gauge.

The following portion of this paragraph delineates example 29 of thesubject matter, disclosed herein. According to example 29, whichencompasses any one of examples 20-28, above, the build plate comprisesa non-conductive substrate, the cathode portion comprises a conductivelayer on a surface of the non-conductive substrate, the conductivesurface is defined by the conductive layer, and the conductive layercomprises circuit traces, each forming part of the same electricalcircuit or a corresponding one of multiple electrical circuits formed onor in the non-conductive substrate.

The following portion of this paragraph delineates example 30 of thesubject matter, disclosed herein. According to example 30, whichencompasses any one of examples 20-29, above, the build plate comprisesan excess material portion configured to be removed after the materialis deposited onto the cathode portion.

The following portion of this paragraph delineates example 31 of thesubject matter, disclosed herein. According to example 31, whichencompasses any one of examples 20-30, above, the build plate comprisesa pre-used part comprising a worn portion from which worn material hasbeen removed.

The following portion of this paragraph delineates example 32 of thesubject matter, disclosed herein. According to example 32, anelectrochemical additive manufacturing method is disclosed. The methodcomprises a step of positioning a build plate into an electrolytesolution such that a conductive layer of the build plate directlycontacts the electrolyte solution. The conductive layer comprises atleast one conductive-layer segment forming a pattern corresponding witha component. The method also comprises positioning a deposition anodearray, comprising a plurality of deposition anodes, into the electrolytesolution such that a gap is established between the at least oneconductive-layer segment and the deposition anode array. The methodfurther comprises connecting the at least one conductive-layer segmentto a power source and connecting one or more deposition anodes of theplurality of deposition anodes to the power source. The one or moredeposition anodes of the plurality of deposition anodes correspond withat least a portion of the pattern formed by the at least oneconductive-layer segment. The method additionally comprises transmittingelectrical energy from the power source through the one or moredeposition anodes of the plurality of deposition anodes correspondingwith the at least the portion of the pattern formed by the at least oneconductive-layer segment, through the electrolyte solution, and to theat least one conductive-layer segment, such that material is depositedonto the at least one conductive-layer segment and forms at least aportion of the component.

The following portion of this paragraph delineates example 33 of thesubject matter, disclosed herein. According to example 33, whichencompasses example 32, above, the one or more deposition anodes of theplurality of deposition anodes, corresponding with the at least theportion of the pattern formed by the at least one conductive-layersegment, form a pattern matching the at least the portion of the patternformed by the at least one conductive-layer segment.

The following portion of this paragraph delineates example 34 of thesubject matter, disclosed herein. According to example 34, whichencompasses any one of examples 32 and 33, above, the at least oneconductive-layer segment comprises an elongated strip of electricallyconductive material.

The following portion of this paragraph delineates example 35 of thesubject matter, disclosed herein. According to example 35, whichencompasses any one of examples 32-34, above, the conductive layercomprises multiple conductive-layer segments. The multipleconductive-layer segments are electrically isolated from each other viathe dielectric layer.

The following portion of this paragraph delineates example 36 of thesubject matter, disclosed herein. According to example 36, whichencompasses example 35, above, the electrochemical additivemanufacturing method further comprises electrically coupling togetherthe multiple conductive-layer segments, and synchronously depositing thematerial onto the multiple conductive-layer segments.

The following portion of this paragraph delineates example 37 of thesubject matter, disclosed herein. According to example 37, whichencompasses any one of examples 35 and 36, above, the electrochemicaladditive manufacturing method further comprises connecting a first oneof the multiple conductive-layer segments to the power sourceindependently of a second one of the multiple conductive-layer segments,depositing the material onto the first one of the multipleconductive-layer segments, and depositing the material onto the secondone of the multiple conductive-layer segments. The material is depositedonto the first one of the multiple conductive-layer segmentsasynchronously relative to the deposition of the material onto thesecond one of the multiple conductive-layer segments.

The following portion of this paragraph delineates example 38 of thesubject matter, disclosed herein. According to example 38, whichencompasses any one of examples 32-37, above, the conductive layerconsists of a patterned foil of electrically conductive material.

The following portion of this paragraph delineates example 39 of thesubject matter, disclosed herein. According to example 39, whichencompasses any one of examples 32-38, above, the build plate is aprinted circuit board comprising a dielectric layer, made of anelectrically insulating material, and the at least one conductive-layersegment.

The following portion of this paragraph delineates example 40 of thesubject matter, disclosed herein. According to example 40, whichencompasses any one of examples 32-39, above, the build plate comprisesa substrate, made of one of an electrically non-conductive material or asemiconductor material, and the at least one conductive-layer segment ison the substrate.

The following portion of this paragraph delineates example 41 of thesubject matter, disclosed herein. According to example 41, whichencompasses any one of examples 32-40, above, the electrochemicaladditive manufacturing method further comprises transmitting anelectrical signal through the material after a quantity of the materialis deposited onto the conductive-layer segment, sensing a characteristicof the electrical signal, and depositing an additional quantity of thematerial onto the quantity of the material in response to a sensedcharacteristic of the electrical signal.

The following portion of this paragraph delineates example 42 of thesubject matter, disclosed herein. According to example 42, whichencompasses any one of examples 32-41, above, the electrochemicaladditive manufacturing method further comprises transmitting anelectrical signal through the material after a quantity of the materialis deposited onto the conductive-layer segment, sensing a characteristicof the electrical signal, and depositing additional quantities of thematerial onto the conductive-layer segment until a sensed characteristicof the electrical signal reaches a predetermined threshold.

The following portion of this paragraph delineates example 43 of thesubject matter, disclosed herein. According to example 43, whichencompasses any one of examples 32-42, above, the component comprises acapacitor, the conductive layer comprises multiple conductive-layersegments, the build plate further comprises a dielectric layer, themultiple conductive-layer segments are electrically isolated from eachother, and the material deposited onto the multiple conductive-layersegments forms two opposing plates of the capacitor.

The following portion of this paragraph delineates example 44 of thesubject matter, disclosed herein. According to example 44, whichencompasses any one of examples 32-43, above, the component comprises aresistor, the conductive layer comprises multiple conductive-layersegments, the build plate further comprises a dielectric layer, themultiple conductive-layer segments are electrically isolated from eachother, and the material deposited onto the multiple conductive-layersegments forms two opposing walls of the resistor. The method furthercomprises depositing an electrically resistive material into a gapdefined between the two opposing walls of the resistor.

The following portion of this paragraph delineates example 45 of thesubject matter, disclosed herein. According to example 45, whichencompasses any one of examples 32-44, above, the component comprises anelectronic sensor component, and the at least one conductive-layersegment and the material deposited onto the at least oneconductive-layer segment form an electronic sensor component.

The following portion of this paragraph delineates example 46 of thesubject matter, disclosed herein. According to example 46, whichencompasses example 45, above, the electronic sensor component comprisesat least one of a thermocouple or a strain gauge.

The following portion of this paragraph delineates example 47 of thesubject matter, disclosed herein. According to example 47, whichencompasses any one of examples 32-46, above, the component comprises asurface mount technology (SMT) passive component, and the materialdeposited onto the at least one conductive-layer segment forms the SMTpassive component.

The following portion of this paragraph delineates example 48 of thesubject matter, disclosed herein. According to example 48, whichencompasses any one of examples 32-47, above, the conductive layercomprises multiple conductive-layer segments, the build plate furthercomprises a dielectric layer, the multiple conductive-layer segments areelectrically isolated from each other, and the material deposited ontothe multiple conductive-layer segments forms an electrical connectionthat electrically couples together the multiple conductive-layersegments.

The following portion of this paragraph delineates example 49 of thesubject matter, disclosed herein. According to example 49, whichencompasses any one of examples 32-48, above, the component comprises aradio-frequency (RF) component, and the material deposited onto the atleast one conductive-layer segment forms the RF component.

The following portion of this paragraph delineates example 50 of thesubject matter, disclosed herein. According to example 50, anelectrochemical deposition system for fabricating a manufactured partcomprises an electrodeposition cell, configured to hold an electrolyticfluid. The system also comprises a build plate, comprising a conductivelayer that comprises at least one conductive-layer segment forming apattern corresponding with a component. The system further comprises adeposition anode array, comprising a plurality of deposition anodes, anda mounting system, configured to position the at least oneconductive-layer segment and the plurality of deposition anodes indirect contact with the electrolytic fluid, such that a gap isestablished between the at least one conductive-layer segment and theplurality of deposition anodes, when the electrolytic fluid is held inthe electrodeposition cell. The system additionally comprises a powersource, configured to create a voltage potential on the at least oneconductive-layer segment, and a positioning system, configured tocontrol a distance between the at least one conductive-layer segment andthe plurality of deposition anodes. The system also comprises acontroller, configured to control a current field across depositionanodes of the plurality of deposition anodes corresponding with at leasta portion of the pattern formed by the at least one conductive-layersegment, when the electrodeposition cell holds the electrolytic fluidand the at least one conductive-layer segment and the plurality ofanodes are positioned in direct contact with the electrolytic fluid, toselectively deposit material onto the at least one conductive-layersegment to form at least a portion of the component.

The following portion of this paragraph delineates example 51 of thesubject matter, disclosed herein. According to example 51, whichencompasses example 50, above, the build plate is a printed circuitboard comprising a dielectric layer, made of an electrically insulatingmaterial, and the at least one conductive-layer segment.

The following portion of this paragraph delineates example 52 of thesubject matter, disclosed herein. According to example 52, whichencompasses any one of examples 50 or 51, above, the build platecomprises a substrate made of one of an electrically non-conductivematerial or a semiconductor material. The at least one conductive-layersegment is on the substrate.

The following portion of this paragraph delineates example 53 of thesubject matter, disclosed herein. According to example 53, whichencompasses any one of examples 50-52, above, the deposition anodes ofthe plurality of deposition anodes, corresponding with the at least theportion of the pattern formed by the at least one conductive-layersegment, form a pattern matching at least the portion of the patternformed by the at least one conductive-layer segment.

The described features, structures, advantages, and/or characteristicsof the subject matter of the present disclosure may be combined in anysuitable manner in one or more examples and/or implementations. In thefollowing description, numerous specific details are provided to imparta thorough understanding of examples of the subject matter of thepresent disclosure. One skilled in the relevant art will recognize thatthe subject matter of the present disclosure may be practiced withoutone or more of the specific features, details, components, materials,and/or methods of a particular example or implementation. In otherinstances, additional features and advantages may be recognized incertain examples and/or implementations that may not be present in allexamples or implementations. Further, in some instances, well-knownstructures, materials, or operations are not shown or described indetail to avoid obscuring aspects of the subject matter of the presentdisclosure. The features and advantages of the subject matter of thepresent disclosure will become more fully apparent from the followingdescription and appended claims, or may be learned by the practice ofthe subject matter as set forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

In order that the advantages of the subject matter may be more readilyunderstood, a more particular description of the subject matter brieflydescribed above will be rendered by reference to specific examples thatare illustrated in the appended drawings. Understanding that thesedrawings, which are not necessarily drawn to scale, depict only certainexamples of the subject matter and are not therefore to be considered tobe limiting of its scope, the subject matter will be described andexplained with additional specificity and detail through the use of thedrawings, in which:

FIG. 1 is a schematic, side elevation view of an electrochemicaldeposition system for manufacturing a part, according to one or moreexamples of the present disclosure;

FIG. 2 is a schematic, side elevation view of a heat exchanger made byand including a cathode portion of a build plate of the system of FIG. 1, according to one or more examples of the present disclosure;

FIG. 3A is a schematic, side elevation view of a vapor chamber beingassembled, according to one or more examples of the present disclosure;

FIG. 3B is a schematic, side elevation view of a vapor chamber made byand including cathode portions of build plates of the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 4A is a schematic, side elevation view of a vapor chamber beingassembled, according to one or more examples of the present disclosure;

FIG. 4B is a schematic, side elevation view of a vapor chamber made byand including cathode portions of build plates of the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 5A is a schematic, side elevation view of a cathode portion of abuild plate, and material deposited on the cathode portion using thesystem of FIG. 1 , according to one or more examples of the presentdisclosure;

FIG. 5B is a schematic, side elevation view of a vapor chamber beingassembled, according to one or more examples of the present disclosure;

FIG. 5C is a schematic, side elevation view of a vapor chamber made byand including cathode portions of build plates of the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 6A is a schematic, side elevation view of a cathode portion of abuild plate and material deposited on the cathode portion using thesystem of FIG. 1 , according to one or more examples of the presentdisclosure;

FIG. 6B is a schematic, side elevation view of a vapor chamber beingassembled, according to one or more examples of the present disclosure;

FIG. 6C is a schematic, side elevation view of a vapor chamber made byand including a cathode portion of a build plate of the system of FIG. 1, according to one or more examples of the present disclosure;

FIG. 7A is a schematic, side elevation view of material being depositedonto a cathode portion of a build plate using the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 7B is a schematic, side elevation view of a lead frame packagebeing assembled, according to one or more examples of the presentdisclosure;

FIG. 7C is a schematic, side elevation view of a lead frame package madeby and including a cathode portion of a build plate of the system ofFIG. 1 , according to one or more examples of the present disclosure;

FIG. 8A is a schematic, side elevation view of material being depositedonto a cathode portion of a build plate using the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 8B is a schematic, side elevation view of a lead frame package madeby and including a cathode portion of a build plate of the system ofFIG. 1 , according to one or more examples of the present disclosure;

FIG. 9A is a schematic, side elevation view of material being depositedonto a cathode portion of a build plate using the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 9B is a schematic, side elevation view of a tool, including thecathode portion of a build plate of the system of FIG. 1 , being used toassemble a lead frame package, according to one or more examples of thepresent disclosure;

FIG. 9C is a schematic, side elevation view of material being removedfrom the cathode portion of the tool of FIG. 9B, according to one ormore examples of the present disclosure;

FIG. 10A is a schematic, side elevation view of a deposition anode arrayand cathode portion of a build plate, having a photomask layer, of thesystem of FIG. 1 , according to one or more examples of the presentdisclosure;

FIG. 10B is a schematic, side elevation view of material being depositedonto the cathode portion of FIG. 10A, according to one or more examplesof the present disclosure;

FIG. 11A is a schematic, side elevation view of a deposition anode arrayand a cathode portion of a build plate, having a pre-applied conductivelayer, of the system of FIG. 1 , according to one or more examples ofthe present disclosure;

FIG. 11B is a schematic, side elevation view of material being depositedonto the cathode portion of FIG. 11A, according to one or more examplesof the present disclosure;

FIG. 12 is a schematic, side elevation view of a cathode portion of abuild plate and material deposited on the cathode portion using thesystem of FIG. 1 , according to one or more examples of the presentdisclosure;

FIG. 13A is a schematic, side elevation view of a deposition anode arrayand a cathode portion of a build plate, having channels, of the systemof FIG. 1 , according to one or more examples of the present disclosure;

FIG. 13B is a schematic, side elevation view of a deposition anode arrayand a cathode portion of a build plate, having channels, of the systemof FIG. 1 , according to one or more examples of the present disclosure;

FIG. 14 is a schematic, side elevation view of an electrochemicaldeposition system, according to one or more examples of the presentdisclosure;

FIG. 15 is a block diagram of an electrochemical additive manufacturingmethod, according to one or more examples of the present disclosure;

FIG. 16A is a schematic, side elevation view of a deposition anode arrayand a cathode portion of a build plate of the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 16B is a schematic, side elevation view of a deposition anode arrayand a cathode portion of a build plate of the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 17A is a schematic, side elevation view of a deposition anode arrayand a cathode portion of a build plate of the system of FIG. 1 ,according to one or more examples of the present disclosure;

FIG. 17B is a schematic, side elevation view of a material being removedfrom a build plate of the system of FIG. 1 , according to one or moreexamples of the present disclosure;

FIG. 18A is a schematic, perspective view of a build plate, having apre-applied conductive layer, of the system of FIG. 1 , according to oneor more examples of the present disclosure;

FIG. 18B is a schematic, perspective view of a capacitor, according toone or more examples of the present disclosure;

FIG. 19 is a schematic, perspective view of a build plate, according toone or more examples of the present disclosure;

FIG. 20A is a schematic, perspective view of a build plate, having apre-applied conductive layer, of the system of FIG. 1 , according to oneor more examples of the present disclosure;

FIG. 20B is a schematic, perspective view of a resistor, according toone or more examples of the present disclosure; and

FIG. 21 is a schematic, perspective view of a resistor, according to oneor more examples of the present disclosure.

DETAILED DESCRIPTION

Reference throughout this specification to “one example,” “an example,”or similar language means that a particular feature, structure, orcharacteristic described in connection with the example is included inat least one example of the present disclosure. Appearances of thephrases “in one example,” “in an example,” and similar languagethroughout this specification may, but do not necessarily, all refer tothe same example. Similarly, the use of the term “implementation” meansan implementation having a particular feature, structure, orcharacteristic described in connection with one or more examples of thepresent disclosure, however, absent an express correlation to indicateotherwise, an implementation may be associated with one or moreexamples.

Disclosed herein are examples of an electrochemical additivemanufacturing process for constructing a metal part or a metallicportion of a part by reducing charged metal ions onto a surface in anelectrolyte solution. Electrochemical additive manufacturing, otherwiseknown as electrochemical deposition manufacturing, includes placement ofa printhead, including at least one deposition anode, physically closeto a cathode in the presence of a deposition solution (e.g., anelectrolyte), and energizing the deposition anode, which causes anelectrical charge to flow through the deposition anode. The flow of theelectrical charge through the deposition anode creates anelectrochemical reduction reaction to occur at the cathode, near thedeposition anode, which results in the deposition of material on thecathode.

The cathode of the electrochemical additive manufacturing method andsystem disclosed herein is a cathode portion of a multi-purpose buildplate. In other words, rather than only providing the single function ofa surface of a system onto which a part is formed, the multi-purposebuild plate of the present disclosure also provides additionalfunctionality. According to some examples of the present disclosure, thebuild plate, and the material deposited on the cathode portion of thebuild plate, form at least a portion of a finished product, the cathodeportion of the build plate includes a patterned conductive surface,and/or the build plate, including the cathode portion, is used as a toolto apply the deposited material onto a separate part. In this manner,the build plate, which is necessary to induce deposition of materialfrom the electrolyte solution during an electrochemical additivemanufacturing process, instead of being a single-use component, is amulti-use component that is further utilized as part of a manufacturedproduct or a tool that facilitates manufacture of a manufacturedproduct.

Referring to FIG. 1 , according to some examples, an electrochemicaldeposition system 100 includes a printhead 101 that contains at leastone deposition anode 111. In certain examples, the printhead 101contains a plurality of deposition anodes 111 arranged into a depositionanode array 113. The printhead 101 further includes at least onedeposition control circuit corresponding with the deposition anode 111.In examples where the printhead 101 contains the deposition anode array113, the printhead 101 includes a plurality of deposition controlcircuits 115 where at least one of the deposition control circuits 115corresponds with each one of the deposition anodes 111 of the depositionanode array 113. The deposition control circuits 115 are organized intoa matrix arrangement, in some examples, thereby supporting a highresolution of deposition anodes 111. The deposition anodes 111 of thedeposition anode array 113 are arranged to form a two-dimensional gridin some examples. In FIG. 1 , one dimension of the grid is shown withthe other dimension of the grid going into and/or coming out of thepage.

The printhead 101 further includes a grid control circuit 103 thattransmits control signals to the deposition control circuits 115 tocontrol the amount of electrical current flowing through each one of thedeposition anodes 111 of the deposition anode array 113. The printhead101 additionally includes a power distribution circuit 104. Theelectrical current, supplied to the deposition anodes 111 via control ofthe grid control circuit 103, is provided by the power distributioncircuit 104, which routes power from an electrical power source 119(see, e.g., FIG. 12 ) of the electrochemical deposition system 100 tothe deposition control circuits 115 and then to the deposition anodes111. Although not shown, in some examples, the printhead 101 alsoincludes features, such as insulation layers, that help protect otherfeatures of the printhead 101 from an electrolyte solution 110, asdescribed in more detail below.

The electrochemical deposition system 100 further includes a build plate120 and the electrolyte solution 110, which can be contained within apartially enclosed container 191. In some examples, the electrolytesolution 110 includes one or more of, but not limited to, plating baths,associated with copper, nickel, tin, silver, gold, lead, etc., and whichare typically comprised of water, an acid (such as sulfuric acid),metallic salt, and additives (such as levelers, suppressors,surfactants, accelerators, grain refiners, and pH buffers). Theelectrochemical deposition system 100 is configured to move theprinthead 101 relative to the electrolyte solution 110 such that thedeposition anodes 111 of the deposition anode array 113 are submersed inthe electrolyte solution 110. When submersed in the electrolyte solution110, as shown in FIG. 1 , when the build plate 120 and at least one ofthe deposition anodes 111 are connected to a power source 119, and whenan electrical current is supplied to the deposition anodes 111 from thepower source 119, an electrical path (or current) is formed through theelectrolyte solution 110 from each one of the deposition anodes 111 to aconductive surface 131 of a cathode portion 120 of the build plate 102.In such an example, the cathode portion 120 functions as the cathode thecathode-anode circuit of the electrochemical deposition system 100. Theelectrical paths in the electrolyte solution 110 induce electrochemicalreactions in the electrolyte solution 110, between the deposition anodes111 and the conductive surface 131 of the cathode portion 120, whichresults in the formation (e.g., deposition) of material 130 (e.g.,layers of metal) on the conductive surface 131 of the cathode portion120 at locations corresponding to the locations of the deposition anodes111. The material 130, which can be layers of metal, formed by supplyingelectrical current to multiple deposition anodes 111 form one or morelayers or portions of a part in some examples.

Multiple layers, in a stacked formation, at a given location on thecathode portion 120 of the build plate 102 can be formed byincrementally moving the build plate 102, and thus the cathode portion120, away from the depositions anodes 111 and consecutively supplying anelectrical current to the deposition anode 111 corresponding with thatlocation. The material 130 can have an intricate and detailed shape bymodifying or alternating the current flowing through the depositionanodes 111. For example, as shown in FIG. 1 , first ones of thedeposition anodes 111 are energized (shaded in FIG. 1 ), so that thematerial 130 is being deposited near these “energized” deposition anodes111, when second ones of the deposition anodes are not energized(unshaded in FIG. 1 ), so that the material 130 is not being depositednear these “non-energized” deposition anodes 111.

In some examples, the electrochemical deposition system 100 furtherincludes a processor 122. The printhead 101 is electrically coupled withthe processor 122 such that the processor 122 can transmit electricalsignals to the grid control circuit 103. In response to receipt of theelectrical signals from the processor 122, the grid control circuit 103sends corresponding electrical signals to the deposition controlcircuits 115 to selectively turn one or more of the deposition anodes111 of the deposition anode array 113 on or off (or to modify theintensity of electrical current flow through each deposition anode 111).The processor 122 may be, for example and without limitation, amicrocontroller, a microprocessor, a GPU, a FPGA, a SoC, a single-boardcomputer, a laptop, a notebook, a desktop computer, a server, or anetwork or combination of any of these devices.

According to certain examples, the electrochemical deposition system 100additionally includes one or more sensors 123. The processor 122 iselectrically coupled with the sensors 123 to receive feedback signalsfrom the sensors 123. The feedback signals include sensedcharacteristics of the electrochemical deposition system 100 that enablea determination of the progress of the metal deposition process forforming the material 130. The sensors 123 may include, for example andwithout limitation, current sensors, voltage sensors, timers, cameras,rangefinders, scales, force sensors, and/or pressure sensors.

One or more of the sensors 123 can be used to measure a distance betweenthe cathode portion 120 and the deposition anode array 113. Measuringthe distance between the cathode portion 120 and the deposition anodearray 113 enables “zeroing” of the deposition anode array 113 relativeto the cathode portion 120 before the material 130 is formed, or to setor confirm the relative position between the deposition anode(s) 111 andcathode portion 120 before forming each successive metal layer of thematerial 130. The accurate positioning of the cathode portion 120relative to the deposition anode array 113 at the initialization of thedeposition process may have a significant impact on the success andquality of the completed deposit. In certain examples, any of varioustypes of sensors, for determining the distance between the cathodeportion 120 and the deposition anode array 113 can be used, including,for example and without limitation, mechanical, electrical, or opticalsensors, or combinations thereof. In one or more examples, mechanicalsensors, such as a pressure sensor, switch, or load cell may beemployed, which detects when the build plate 102, including the cathodeportion 120, is moved and relocated into a desired location. In one ormore examples, one or more components of the electrochemical depositionsystem 100 may be energized, and the cathode portion 120 may be movedinto proximity of the energized components. When a corresponding voltageor current is detected on the cathode portion 120, the cathode portion120 can be considered to be in a known location. According to someexamples, other types of sensors, such as those that detect, forexample, capacitance, impedance, magnetic fields, or that utilize theHall Effect, can be used to determine the location of the cathodeportion 120 relative to the deposition anode array 113.

Referring to FIG. 1 , the electrochemical deposition system 100 furtherincludes a mounting system 195 and a positioning system 199, whichincludes a position actuator 124. As shown in the illustrated example,the build plate 102 is coupled to the position actuator 124, or anadditional or alternative position actuator of the positioning system199, via the mounting system 195. The mounting system 195 is configuredto retain the build plate 102 and to enable the cathode portion 120 ofthe build plate 102 to be positioned in the electrodeposition cell 191.Actuation of the position actuator 124 moves the mounting system 195 andthe build plate 102 relative to the printhead 101 (and thus relative tothe deposition anode array 113). However, in other examples, theprinthead 101, rather than the build plate 102, is coupled to theposition actuator 124 such that actuation of the position actuator 124moves the printhead 101 relative to the build plate 102. In yet otherexamples, both the build plate 102 and the printhead 101 are coupled tothe position actuator 124, such that actuation of the position actuator124 results in one or both of the build plate 102 and the printhead 101moving relative to the other.

The position actuator 124 can be a single actuator or multiple actuatorsthat collectively form the position actuator 124. In certain examples,the position actuator 124 controls vertical movement 125, so that thebuild plate 102 may be raised, relative to the printhead 101, assuccessive layers of the material 130 are built. Alternatively, oradditionally, in some examples, the position actuator 124 controlsvertical movement 125, so that the printhead 101 may be lowered,relative to the build plate 102, as successive layers of the material130 are built. In one or more examples, the position actuator 124 alsomoves the build plate 102, moves the printhead 101, or moves both thebuild plate 102 and the printhead 101 horizontally, relative to oneanother, so that, for example, parts having a footprint larger than thefootprint of the deposition anode array 113 can be formed (see, e.g.,dashed directional arrows associated with the directional arrowcorresponding with the vertical movement 125).

Although not shown with particularity in FIG. 1 , in one or moreexamples, the electrochemical deposition system 100 includes a fluidhandling system fluidically coupled with the electrodeposition cell 191.The fluid handling system may include for example a tank, a particulatefilter, chemically resistant tubing, and a pump. The electrochemicaldeposition system 100 can further include analytical equipment thatenables continuous characterization of bath pH, temperature, and ionconcentration using methods such as conductivity, high performanceliquid chromatography, mass spectrometry, cyclic voltammetry stripping,spectrophotometer measurements, or the like. Bath conditions may bemaintained with a chiller, heater and/or an automated replenishmentsystem to replace solution lost to evaporation and/or ions of depositedmaterial.

Although the electrochemical deposition system 100 shown in FIG. 1 has asingle printhead 101 with a single deposition anode array 113, in one ormore alternative examples, the electrochemical deposition system 100includes multiple printheads 101, each with one or more deposition anodearrays 113, or a single printhead 101 with multiple deposition anodearrays 113. These multiple deposition anode arrays 113 may operatesimultaneously in different chambers filled with electrolyte solution,or may be tiled in a manner where the deposition anode arrays 113 worktogether to deposit material on a shared build plate or series of buildplates.

Referring to FIG. 15 , according to some examples, an electrochemicaladditive manufacturing method 400 includes (block 402) positioning theconductive surface 131 of the cathode portion 120 of the build plate 102into the electrolyte solution 110 such that the conductive surface 131directly contacts the electrolyte solution 110. The method 400additionally includes (block 404) positioning the deposition anode 111into the electrolyte solution 110 such that a gap 133 is defined betweenthe conductive surface 131 of the cathode portion 120 and the depositionanode 111. The method 400 further includes (block 406) transmittingelectrical energy through the deposition anode 111. As presented above,the electrical energy can be supplied by the electrical power source119. The method 400 also includes (block 408) transmitting theelectrical energy from the deposition anode 111, through the electrolytesolution 110, and to the conductive surface 131 of the cathode portion120, such that the material 130 is deposited onto the conductive surface131 of the cathode portion 120. The material 130 deposited directly ontothe conductive surface 131 is a first layer of the material 130.

The above-mentioned steps can be executed consecutively any number oftimes to deposit additional portions of the material 130 onto previouslydeposited layers of the material 130. Moreover, an additional layer ofthe material 130 can be deposited onto a previously deposited layerdirectly above and/or laterally offset from the previously depositedlayer. In this manner, the method 400 can be executed to form thematerial 130 into any of various types of components that have verticalfeatures, horizontal features, or some combination of vertical andhorizontal features, such as overhangs. Some examples include columns,pillars, walls, bumps, traces, pads, horizontal layers, coils, antennas,resistors, capacitors, connectors, thermal management features, such aspins, fins, lattices, vapor chambers, heat pipes, etc.

After the material 130 is deposited onto the cathode portion 120, insome examples, at block 410 of the method 400, the build plate 102,including the cathode portion 120, and the material 130 form (or areformed into) a finished product or, at block 412 of the method 400, thebuild plate 102, including the cathode portion 120, form a tool and, atblock 414, the tool is used to help form the material 130 into afinished product. Additionally, or alternatively, in certain examples,at block 416 of the method 400, the cathode portion 120 is patternedprior to depositing the material 130 onto the cathode portion 120.Accordingly, referring to FIG. 15 , after the material 130 is depositedonto the conductive surface 131 of the cathode portion 120 at block 408,the method 400 proceeds to execute at least one of block 410, blocks412-414, or block 416.

As shown in FIG. 15 , according to some examples, at block 410 of themethod 400, the build plate 102 and the material 130 form at least aportion of a finished product 200 having a particular functionality andthe build plate 102 at least partially enables the particularfunctionality. According to block 410, the material 130 is not removedfrom the cathode portion 120 to form the material 130 into a finishedproduct. Additionally, the build plate 102, and the cathode portion 120of the build plate 102, do not provide a mere nominal function inrelation to the main function or functions of the finished product. Forexample, when the material 130 is formed into an artistic object (e.g.,sculpture), the main function of the artistic object is to provide anaesthetically pleasing visual work of art. Accordingly, if the buildplate 102 does not contribute to the aesthetic quality of the artisticobject, such as if the build plate 102 merely provides a stand on whichthe artistic object is supported, the function of the build plate 102 ismerely nominal compared to the main function of the artistic object andis not required to fulfill the main function of the artistic object.However, when the build plate 102 is required for the finished productto operate, then the build plate 102 at least partially enables theparticular functionality of the finished product. For example, the buildplate 102 can include a self-supporting structure and the material 130forms a non-self supporting structure, such as a thin-walled structure,that is supported by the self-supporting structure.

The build plate 102 includes prefabricated features in some examples.The prefabricated features can provide any of various functionality andbe pre-formed (e.g., prior to depositing the material 130 onto the buildplate 102) using any of various processes, such as one or more ofcasting, forging, rolling, cutting, grinding, and drilling. In certainexamples, the build plate 102 includes a prefabricated thermal featurethat is configured to transfer heat. The material 130 deposited onto thebuild plate 102 is thermally coupled with the thermal feature(s) of thebuild plate 102 to promote heat transfer by or to the thermal feature.

Referring to FIG. 2 , according to one example, the finished product 200includes a heat exchanger 202, that may be, for example, a thermalmanagement feature including, but not limited to, pins, fins, lattices,vapor chambers, and/or heat pipes. The heat exchanger 202 includes aplate 204 and at least one fin 206 attached to the plate 204. In theillustrated example, the heat exchanger 202 includes a plurality of fins206. The heat exchanger 202 defines the build plate 102, such that thebuild plate 102 includes the plate 204 and the at least one fin 206. Theprefabricated thermal feature of the build plate 102 can be the plate204 or the at least one fin 206. The build plate 102 illustrated in FIG.2 , which defines a complex cathode structure, can be prefabricatedusing one or more manufacturing methods, such as electrochemicaldeposition, machining, dip brazing, etc. In some examples, an entiretyof the build plate 102 is made of an electrically conductive material.Accordingly, in such examples, the cathode portion 120 is the entiretyof the build plate 102. In other words, the cathode portion 120 includesthe plate 204 and the at least one fin 206 of the heat exchanger 202.

Referring to FIGS. 3A-6C, in some examples, the heat exchanger 202includes a fluid channel 212 and a heat wicking feature (e.g., a lattice208) located within the fluid channel 212. In some examples, the lattice208 is porous and permeable in a manner consistent with heat pipewicking. The fluid channel 212 is defined, at least partially, by theplate 204, which defines the cathode portion 120 of the build plate 102.

Referring to FIGS. 3A and 3B, in some examples, the heat exchanger 202is made using two separate build plates 102 (e.g., plates 204) with eachbuild plate 102 defining a portion of the fluid channel 212. Thematerial 130 is deposited on the conductive surfaces 131 of the cathodeportions 120 of the build plates 120. Because the plates 204 are made ofan electrically conductive material, the plates 204 define the cathodeportions 120. The material 130 on the cathode portion 120 of a first oneof the build plates 102 forms a first portion 208A of the lattice 208and the material 130 on the cathode portion 120 of a second one of thebuild plates 102 forms a second portion 208B of the lattice 208. Eachone of the build plates 102 has a first free end 214A or side, and asecond free end 214B or side that is opposite the first free end 214A.With the first portion 208A and the second portion 208B facing eachother, as shown in FIG. 3A, the build plates 102 are brought together,the first free ends 214A of the build plates 102 are sealed together,and the second free ends 214B of the build plates 102 are sealedtogether. In some examples, the free ends of the build plates 102 aresealed together via welding, soldering, brazing, adhering, fastening,and/or the like. The unsealed portions of the build plates 102 definethe fluid channel 212. In some examples, the first free ends 214A andthe second free ends 214B of at least one of the build plates 102 isbent to enable a space between the build plates 102 and between thefirst portion 208A and the second portion 208B of the lattice 208. Asshown in FIG. 3B, in some examples, one or more of the build plates 102(e.g., plates 204) includes one or more fins 206 such that the fins 206are located outside the fluid channel 212.

Referring to FIGS. 4A and 4B, in some examples, there is no spacebetween the first portion 208A and the second portion 208B of thelattice 208 at one or more locations along the lattice 208. In otherwords, in some examples, the first portion 208A and the second portion208B of the lattice 208 contact each other at one or more locations,which helps to add stiffness or increase the rigidity of the fluidchannel 212. To help secure the first portion 208A relative to thesecond portion 208B, in some examples, the first portion 208A and thesecond portion 208B are nestably engaged at one or more locations alongthe lattice 208. In the illustrated example, the first portion 208Aincludes recesses 220 and the second portion 208B includes protrusions222. Each one of the protrusions 222 is nestably inserted into acorresponding one of the recesses 220 when the first free ends 214A andthe second free ends 214B are sealed together. Although the lattice 208of the heat exchanger 202 of FIG. 4B includes three recesses 220 andthree protrusions 222, it is recognized that the heat exchanger 202 caninclude less than three (e.g., one) or more than three recesses 220 andless than three (e.g., one) or more than three protrusions 222.

Referring to FIGS. 5A and 5C, in some examples, the heat exchanger 202is made by depositing the material 130 on the conductive surface 131 ofthe cathode portion 120 of a single build plate 102. The material 130 onthe build plate 102, which is deposited on the same conductive surface131 of the cathode portion 120 of the build plate 102, is separated intoa first portion 208A of the lattice 208 and a second portion 208B of thelattice 208. The first portion 208A is deposited onto a first portion120A of the build plate 102 (e.g., a first portion of the cathodeportion 120 of the build plate 102) and the second portion 208B isdeposited onto a second portion 120B of the build plate 102 (e.g., asecond portion of the cathode portion 120 of the build plate 102). Thebuild plate 102 has a first free end 214A and a second free end 214Bthat is opposite the first free end 214A. With the first portion 208Aand the second portion 208B of the lattice 208 facing in the samedirection, as shown in FIG. 5A, the build plate 102 is bent at alocation between the first portion 120A and the second portion 120B ofthe build plate 102 and between the first portion 208A and the secondportion 208B of the lattice 208 (see, e.g., FIG. 5B). The build plate102 is thus folded back over itself until the first portion 208A and thesecond portion 208B of the lattice 208 face each other (see, e.g., FIG.5C). In this position, the first free end 214A and the second free end214B of the build plate 102 are brought together and sealed. Theunsealed portion of the first portion 120A and the second portion 120Bof the build plate 102 define the fluid channel 212. In some examples,one or both of the first free end 214A and the second free end 214B ofthe build plate 102 is bent, and the fold of the build plate 102 can beconfigured, to enable a space between the first portion 208A and thesecond portion 208B of the build plate 102 and between the first portion208A and the second portion 208B of the lattice 208. According to thisexample, the build plate 102 is made of a conductive material, and has asize and shape, that enables bending of the build plate 102. As usedherein, unless otherwise noted, conductive means electricallyconductive.

Referring to FIGS. 6A-6C, in some examples, there is no space betweenthe first portion 208A and the second portion 208B of the lattice 208 atone or more locations along the lattice 208 after the build plate 102 isbent. In other words, in some examples, the first portion 208A and thesecond portion 208B of the lattice 208 contact each other at one or morelocations, which helps to add stiffness or increase the rigidity of theheat exchanger 202. To help secure the first portion 208A relative tothe second portion 208B, in some examples, the first portion 208A andthe second portion 208B are nestably engaged at one or more locationsalong the lattice 208. In the illustrated example, the first portion208A includes recesses 220 and the second portion 208B includesprotrusions 222. Each one of the protrusions 222 is nestably insertedinto a corresponding one of the recesses 220 as the first portion 120Aof the build plate 102 is bent over the second portion 120B of the buildplate 102, and when the first free ends 214A and the second free ends214B are sealed together. Although the lattice 208 of the heat exchangerof FIG. 6C includes three recesses 220 and three protrusions 222, it isrecognized that the lattice 208 can include less than three (e.g., one)or more than three recesses 220 and less than three (e.g., one) or morethan three protrusions 222.

Now Referring to FIGS. 7A-8B, according to some examples, the finishedproduct 200 is a lead-frame package 250. The lead-frame package 250includes a lead frame 240, a die 230, and a wire 234. The wire 234 isattached to and extends between the lead frame 240 and the die 230. Morespecifically, the wire 234 is attached to and extends between alead-frame terminal 244 of the lead frame 240 and a die terminal 232 ofthe die 230. When attached to the lead-frame terminal 244 and the dieterminal 232, the wire 234 electrically couples the die 230 to the leadframe 240. The die 230 includes a non-conductive substrate 231 and thedie terminal 232, which is made of a conductive material, is formed inor on the non-conductive substrate 231. Similarly, the lead frame 240includes a non-conductive substrate 242 and the lead-frame terminal 244,which is made of a conductive material, is formed in or on thenon-conductive substrate 242. Some examples may include othersemiconductor packaging substrate types such as ceramic-based (DBC),laminate-based (BGA), glass (interposer), etc.

The die 230 is an integrated circuit (e.g., semiconductor die) in someexamples. Accordingly, in such examples, the non-conductive substrate231 is made of a semiconducting material and the die 230 includes afunctional circuit formed into the semiconducting material.

As illustrated, in some examples, the die 230 includes a plurality ofdie terminals 232, the lead frame 240 includes a plurality of lead-frameterminals 244, and the lead-frame package 250 includes a plurality ofwires 234. Each one of the plurality of wires 234 is attached to andelectrically connects a corresponding one of the plurality of dieterminals 232 to a corresponding one of the plurality of lead-frameterminals 244. In one example, the plurality of die terminals 232 arearranged around a perimeter of the die 230 and the plurality oflead-frame terminals 244 are arranged around the die 230, such that thedie 230 is surrounded by the lead-frame terminals 244 and the wires 234are attached to and extend from all sides of the die 230.

In one example, shown in FIGS. 7A-7C, the build plate 102 forms only thelead frame 240 and the material 130 deposited onto the lead frame 240forms the entirety of the wire 234 or the wires 234 of the lead-framepackage 250. Unlike the build plate 102 shown in FIGS. 2-6C, in whichthe cathode portion 102 is formed of an entirety of the build plate 102,the cathode portion 120 of the build plate 102 in FIGS. 7A-7C forms onlya portion of the build plate 102. More specifically, the cathode portion120 is just the lead-frame terminals 244 and the conductive surface 131is a surface of the lead-frame terminals 244, with the non-conductivesubstrate 242 forming a remainder of the build plate 102. As shown, thelead frame 240, acting as the build plate 102, is positioned in theelectrolyte solution 110 such that a gap is defined between thelead-frame terminals 244 and the deposition anode array 113. Electricalenergy is then supplied to the deposition anode array 113 such that thewires 234 form on the lead-frame terminals 244. In the present example,the wires 234 are formed with an overhang such that free ends of thewires 234 extends out over an opening or recess in the lead frame 240.After the wires 234 are completely formed, the build plate 102, which inthis example is the lead frame 240, is removed from the electrolytesolution 110.

Referring to FIG. 7B, the die 230 is then moved into an attachmentposition in the opening or recess in the lead frame 240. Movement of thedie 230 can be performed manually or automatically. In the attachmentposition, the die terminals 232 are in a position, relative to free endsof the wires 234 (e.g., in contact with the free ends of the wires 234),ready for attachment of free ends of corresponding ones of the wires 234to the die terminals 232. As shown in FIG. 7C, attachment of the freeends of the wires 234 to the die terminals 232 is accomplished withsolder 251 via a soldering process. In the attachment position, the dieterminals 232 and the lead-frame terminals 244 can be on differentplanes, as shown in FIG. 7C. However, in other examples, the dieterminals 232 and the lead-frame terminals 244 are on the same plane.

Although in the example shown in FIGS. 7A-7C, the build plate 102 formsonly the lead frame 240, in other examples, the build plate 102 can formonly the die 230. In such examples, the material 130 is deposited ontodie terminals 232 of the die 230 in the presence of the electrolytesolution 110 and the material 130 forms the entirety of the wire 234 orthe wires 234 of the lead-frame package 250. The wires 234 would beformed with an overhang such that free ends of the wires 234 extends outover and beyond a periphery of the die 230. After the wires 234 arecompletely formed, the die 230 is removed from the electrolyte solution110 and the lead frame 240 is moved into an attachment position aroundthe die 230. Movement of the lead frame 240 can be performed manually orautomatically. In the attachment position, the lead-frame terminals 244are in a position, relative to free ends of the wires 234 (e.g., incontact with the free ends of the wires 234), ready for attachment offree ends of corresponding ones of the wires 234 to the lead-frameterminals 244

Referring now to FIGS. 8A and 8B, the build plate 102 forms both thelead frame 240 and the die 230 of the lead-frame package 250, which canbe supported on a support plate 198 and movable relative to thedeposition anode array 113 via actuation of the support plate 198.Unlike the build plate 102 shown in FIGS. 2-6C, in which the cathodeportion 120 is formed of an entirety of the build plate 102, the cathodeportion 120 of the build plate 102 in FIGS. 8A-8C forms only a portionof the build plate 102. More specifically, the cathode portion 120 isjust the lead-frame terminals 244 and the die terminals 232 and theconductive surface 131 is a surface of the lead-frame terminals 244 andthe die terminals 232, with the non-conductive substrate 242 and thenon-conductive substrate 231 forming a remainder of the build plate 102.Accordingly, the material 130 is deposited onto both the lead-frameterminals 244 of the lead frame 240 and the die terminals 232 of thedie, to form the wires 234 of the lead-frame package 250, when the leadframe 240 and the die 230 are positioned in the electrolyte solution110. After the wires 234 are completely formed, the lead-frame package250 is removed from the electrolyte solution 110. It can be appreciatedthat in the example illustrated in FIGS. 8A and 8B, solder is notrequired to electrically connect the wires 234 to the lead frame 240 andthe die 230. The die terminals 232 and the lead-frame terminals 244 canbe on different planes, as shown in FIG. 8B when the material 130 isdeposited thereon to form the wires 234. However, in other examples, thedie terminals 232 and the lead-frame terminals 244 are on the same planewhen the material 130 is deposited thereon to form the wires 234.

Now referring to FIGS. 10A and 10B, according to some examples, thefinished product 200 is an integrated circuit that includes a substrate,such as semiconductor-based wafer 268, and one or more of a pillar, via,or other thin-walled structure formed on the semiconductor-based wafer268. The semiconductor-based wafer 268 can be made of a semiconductormaterial, such as, for example, Si (silicon), SiC (silicon carbide), GaN(gallium nitride), MoS2 (molybdenum disulfide), etc. The build plate 102is the semiconductor-based wafer 268 and the material 130 deposited ontothe build plate 102 forms the thin-walled structure. The process formaking the integrated circuit of FIGS. 10A and 10B is described in moredetail below.

Referring to FIGS. 11A and 11B, according to certain examples, thefinished product 200 is a printed circuit board 304 that includes anon-conductive substrate 300 (e.g., dielectric) that has a core layermade of an electrically non-conductive material or a semiconductivematerial. The printed circuit board 304 also includes a conductive layer302 on the surface of the non-conductive substrate 300. The conductivelayer 302 includes one or more conductive features, such as anelectrical pad or an electrical trace (see, e.g., conductive-layersegments 302A) deposited (e.g., attached, printed, applied, painted,etc.) onto the non-conductive substrate 300. The substrate 300 can be afixed (e.g., rigid) substrate or a flexible substrate.

The printed circuit board 304 also includes electrical components (e.g.,wires 234 or bumps 235) that are electrically connected to one or moreconductive features of the conductive layer 302. For example, the wire234 in FIG. 11B electrically connects two conductive-layer segments 302A(e.g., two electrical pads). In some examples, each one of theconductive-layer segments 302A can form part of the same electricalcircuit or a corresponding one of multiple electrical circuits formed onor in the non-conductive substrate 300. According to certain examples,the electrical components can be any of various electrical componentsother than wires or bumps, such as antennas, waveguides, and the like.The electrical components can be configured such that the finishedproduct 200, including the build plate 102, the cathode portion 120, andthe material 130, form an electronic sensor, which, in certain examples,is at least one of a thermocouple or a strain gauge. The material 130forms at least part of a surface mount technology (SMT) passivecomponent or a radio-frequency (RF) component in some examples.

Unlike the build plate 102 shown in FIGS. 2-6C, in which the cathodeportion 102 is formed of an entirety of the build plate 102, the cathodeportion 120 of the build plate 102 in FIGS. 11A and 11B forms only aportion of the build plate 102. More specifically, the cathode portion120 is just the conductive layer 302 and the conductive surface 131 is asurface of the conductive layer 302, with the non-conductive substrate300 forming a remainder of the build plate 102. In other words, thebuild plate 102 is formed by the non-conductive substrate 300 and theconductive layer 302, and the material 130 deposited onto the buildplate 102 forms the electrical components.

As shown in FIG. 15 , according to some examples, at block 412 of themethod 400, the build plate 102 and the material 130 deposited onto thebuild plate 102 form a tool 160. Referring to FIGS. 9A-9C, the buildplate 102, which can be a plate of conductive material, and the material130, deposited onto the build plate 102, form a tool 160 that is used totransfer the material 130 from the tool 160 to an object or part. Likethe build plate 102 shown in FIGS. 2-6C, the cathode portion 102 of thebuild plate 102 of the tool 160 is formed of an entirety of the buildplate 102. In FIG. 9A, the build plate 102 is shown with the material130 deposited onto the conductive surface 131 of the cathode portion 120of the build plate 102. In the illustrated example, the conductivesurface 131 is a flat and non-patterned (e.g., all areas of the surfaceof the cathode portion 120 have the same material depositioncharacteristics). The material 130 deposited onto the build plate 102 inFIG. 9A forms one or more wires 234. The wires 234 are configured toelectrically connect together two electronic devices. In the illustratedexample, the two electronic devices are a die 230 and a lead frame 240of a lead-frame package 250. The wires 234 are formed on the build plate102 to have a size and shape corresponding to the size and shape, andrelative position, of the die 230 and the lead frame 240. Because thewires 234 span a gap between the die 230 and the lead frame 240, thewires 234 are formed on the build plate 102 to have an overhang.

Referring to FIG. 15 , according to some examples, at block 414 of themethod 400, the tool 160 is used to transfer the material 130 from thetool 160 to a part, such as the lead-frame package 250. As shown in FIG.9B, with the wires 234 formed on the build plate 102, the build plate102, functioning as the tool 160, is positioned such that the wires 234are proximate enough to the lead-frame terminals 244 of the lead frame240 and the die terminals 232 of the die 230 to attach (e.g. solder),via the solder 251, each one of the wires 234 to a corresponding one ofthe lead-frame terminals 244 and the die terminals 232. In someexamples, the build plate 102 includes a base 129, which defines thecathode portion 120 and the conductive surface 131, and a post 127 orhandle extending from the base 129. The post 127 helps facilitatepositioning of the tool 160 into position for attaching the wires 234 tothe lead-frame package 250. For example, the post 127 can be secured bya user, whether manually or automatically, and, while securing the post127, the build plate 102 can be moved into position by virtue of movingthe post 127. According to some examples, the post 127 is also used tosecure the build plate 102 to the electrochemical deposition system 100.

Referring to FIG. 9C, after the wires 234 are soldered, or otherwiseattached, to the lead frame 240 and to the die 230, the wires 234 areremoved from the build plate 102. Because the wires 234 are depositedonto the build plate 102 via an electrochemical plating process, andremoval of the wires 234 from the build plate 102 without damaging thewires 234 is desired, the wires 234 are removed by a process 270 thatmaintains the integrity of the wires 234. In some examples, the process270 includes a selective chemical etching process, a thermal treatmentprocess, and/or a mechanical removal process. After removal of the wires234, the tool 160, including the build plate 102, can be reused again asa tool or as a more permanent fixture of the electrochemical depositionsystem 100.

Although the above examples are set forth to facilitate manufacture of alead-frame package by forming wires on a build plate, it is recognizedthat the above examples can be applicable to the manufacture of any ofvarious other types of devices that require wires or otherelectrically-conductive components for operation of the devices.

As shown in FIG. 15 , according to some examples, at block 416 of themethod 400, the conductive surface 131 of the cathode portion 120 of thebuild plate 102 is patterned prior to positioning the conductive surface131 into the electrolyte solution 110. Referring to FIGS. 7A-8B and10A-14B, in some examples, the conductive surface 131 of the cathodeportion 120 is patterned prior to positioning the conductive surface 131of the cathode portion 120 into the electrolyte solution 110. As usedherein, the conductive surface 131 is patterned when a surface of thecathode portion 120 of the build plate 102, configured to be positionedinto the electrolyte solution 110 during an electrochemical additivemanufacturing process, has multiple distinct areas where at least afirst one of the distinct areas (e.g., areas 187) has materialdeposition characteristics that are different than the materialdeposition characteristics of at least a second one of the distinctareas (e.g., areas 189). As used herein, material depositioncharacteristics are characteristics of a material that affect theability of a metallic material to be deposited onto the material via anelectrochemical deposition process. For example, the composition of amaterial of the build plate 102, such as being one of a conductive ornon-conductive material, affects whether metallic material is capable ofbeing deposited onto the build plate 102 via an electrochemicaldeposition process. As another example, the elevations of a material,relative to the deposition anodes 111, can affect whether metallicmaterial is capable of being deposited onto the build plate 102. Incontrast, one example of a build plate 102 that is not patterned is abuild plate where the conductive surface is defined exclusively by theflat planar surface of a base block of the build plate.

One example of a cathode portion 120, of a build plate 102, having aconductive surface 131 that is patterned prior to deposition of materialonto the cathode portion 120 is shown in FIGS. 10A and 10B. The buildplate 102 includes a base 261 made of a conductive material (e.g., aconductive base or a conductive layer on a non-conductive base). Thebase 261 defines a deposition surface 260, which is made of a conductivematerial. The build plate 102 further includes a photomask layer 262applied onto only a portion of the deposition surface 260. The photomasklayer 262 is made of a non-conductive, photomasking material, which canbe patterned through techniques, such as, but not limited to,photolithography, stereolithography, inkjet deposition, imprint-basedlithography, etc. Accordingly, the photomask layer 262 covers a portionof the deposition surface 260 and does not cover another portion of thedeposition surface 260. The portion of the deposition surface 260covered by the photomask layer 262 is defined as a covered portion 264.In contrast, the portion of the deposition surface 260 that is notcovered by the photomask layer 162 is defined as an uncovered portion266. Moreover, the uncovered portion 266 of the deposition surface 260defines the conductive surface 131 of the cathode portion 120 of thebuild plate 102. Accordingly, although the entire base 261 can beconsidered the cathode portion 120 of the build plate 102, only thesurface of the base 261 that is uncovered is considered the conductivesurface 131 of the cathode portion 120. In this manner, the photomasklayer 262, being patterned, helps to pattern the conductive surface 131of the cathode portion 120. Additionally, with the photomask layer 162in place, the build plate 102 has a surface that includes first distinctareas 187, defined by the conductive surfaces 131, and second distinctareas 189, defined by the surfaces of the photomask layer 162.

Referring to FIG. 10B, when electrical current flows through thedeposition anode array 113 and the electrolyte solution 110, thematerial 130 is deposited onto only the uncovered portion 266 of thedeposition surface 260 (i.e., the first distinct areas 187), because theuncovered portion 266 is an exposed conductive surface, and the material130 is not deposited onto the covered portion 264 of the depositionsurface 260 (corresponding with the second distinct areas 189), becausethe covered portion 264 is not exposed to the electrolyte solution 110.The material 130 can be added layer by layer to form a conductivefeature on the build plate 102. In one example, as shown in FIG. 10B,the conductive feature is a pillar, via, or thin-walled structure havinga high aspect ratio. A conductive feature having a high aspect ratio isa conductive feature that has a height H1 that is much greater than awidth W1 (which can be a thickness) of the conductive feature. Accordingto some examples, the height H1 is at least two times the width W1.However, in other examples, the height H1 is at least three times thewidth W1.

The use of the photomask layer 162 to help pattern the conductivesurfaces 131 also facilitates the efficient deposition of the material130 at a footing of the material such that conductive features with highaspect ratio can be formed without additional layers or a thicker layerof photomask. The photomask layer 162 not only defines the conductivesurface 131 onto which the material 130 is deposited, but it alsoinsulates the deposition surface 260 that adjoins the conductive surface131 from secondary current. Accordingly, the material 130 forming afooting of the conductive feature on the conductive surface 131 isconfined to the conductive surface 132 by the photomask layer 162. Inthis manner, excess material is prevented from being deposited aroundthe footing of the conductive feature. After the footing is formed,additional layers of the material 130 can be deposited onto the footingto complete the conductive features. Therefore, a thickness T1 of thephotomask layer 162 can be much less than the height H1 of theconductive feature. After the footing is formed or, alternatively, afterthe conductive feature is fully formed, the photomask layer 162 can bechemically removed prior to use of the build plate 102 as a finishedproduct 200.

Another example of a cathode portion 120, of a build plate 102, having aconductive surface 131 that is patterned prior to deposition of materialonto the build plate 102 is shown in FIGS. 11A and 11B. The build plate102 includes the non-conductive substrate 300 made of a non-conductivematerial. The build plate 102 also includes the conductive layer 302,which defines the conductive surface 131 of the cathode portion 120.Accordingly, the build plate 102 has a surface that includes firstdistinct areas 187, defined by the conductive surfaces 131 of theconductive layer 302, and second distinct areas 189, defined by thesurface of the non-conductive substrate 300. The conductive layer 302can be applied onto the non-conductive substrate 300, prior todeposition of the material 130 onto the conductive layer 302, accordingto any of various patterns. Generally, the patterns are associated witha pattern of an electrical circuit to be formed. In this manner, theconductive surface 131 of the cathode portion 120 of the build plate 102of FIGS. 11A and 11B is patterned prior to the deposition of thematerial 130. Referring to FIG. 11B, when electrical current flowsthrough the deposition anode array 113 and the electrolyte solution 110,the material 130 is deposited onto only the conductive layer 302 and notonto the surface of the non-conductive substrate 300

Another example of cathode portion 120, of a build plate 102, having aconductive surface 131 that is patterned prior to deposition of materialonto the build plate 102 is shown in FIG. 12 . The build plate 102 ismade of a conductive material and defines a deposition surface 260 madeof the conductive material. The deposition surface 260 is not flat.Rather, the deposition surface 260 includes at least one depression 181.Portions of the deposition surface 260 bounding (e.g., circumscribing)the depressions 181 form the conductive surface 131 of the build plate102 of the build plate 102. The depressions 181 are size, shaped, andarranged relative to each other to create a conductive surface 131 thatis patterned. The depressions 181 are formed in the deposition surface260 using an etching process to form etched depressions, in one example,and/or a milling process to form milled depressions.

The ability of the material 130 to be deposited onto a surface of thebuild plate 102 is at least partially dependent on the distance of thesurface away from the deposition anode array 113. For example, if thedistance is too far, the electrical current from the deposition anodearray 113 and passing through the electrolyte solution 110 will not besufficient to deposit the material 130 onto the surface. Accordingly, adistance a surface is away from the deposition anode array 113 isconsidered a material deposition characteristic of that surface. Asshown in FIG. 12 , because the surfaces of the depressions 181 arefurther away from the deposition anode array 113 than the conductivesurface 131 bounding the depressions 181, the material 130 will only bedeposited on the conductive surface 131 and will not be deposited on thesurfaces of the depressions 181. According to the method 400, the buildplate 102 can be positioned relative to the deposition anode array 113such that the build plate 102 has a surface that includes first distinctareas 187, defined by the conductive surfaces 131 of the conductivelayer 302, and second distinct areas 189, defined by the surfaces of thedepressions 181. Because the depressions 181 can be formed into thedeposition surface 260 according to any of various patterns, thecorresponding conductive surface 131 defined between adjacent ones ofthe depressions 181 can also have any of various patterns. In thismanner, conductive surface 131 can be patterned prior to deposition ofthe material 130 onto the conductive surface 131.

Another example of a cathode portion 120, of a build plate 102, having aconductive surface 131 that is patterned prior to deposition of materialonto the build plate 102 is shown in FIGS. 13A and 13B. The build plate102 is made of a conductive material and defines a deposition surface260 made of the conductive material. The build plate 102 includes atleast one channel 183 passing entirely through a thickness of the buildplate 102. In some examples, the build plate 102 includes multiple,spaced apart, channels 183. Each one of the channels 183 extends fromthe deposition surface 260 to a surface of the build plate 102 that isopposite the deposition surface 260. Accordingly, the channel 183 isopen at the deposition surface 260. Because the channel 183 is open atthe deposition surface 260, the channel 183 defines an area of thedeposition surface 260 that is not capable of receiving the material130. Correspondingly, the portions of the deposition surface 260bounding (e.g., circumscribing) the channel 183 form the conductivesurface 131 of the cathode portion 120 of the build plate 102, which iscapable of having the material 130 deposited thereon. According to themethod 400, the build plate 102 can be positioned relative to thedeposition anode array 113 such that the build plate 102 has a surfacethat includes first distinct areas 187, defined by the conductivesurfaces 131 of the conductive layer 302, and second distinct areas 189,defined by the channels 183.

According to some examples, each one of the channels 183 can be one ofan electrolyte solution inlet 185 (see, e.g., FIG. 13A) or anelectrolyte solution outlet 197 (see, e.g., FIG. 13B). The electrolytesolution inlet 185 is fluidically coupled with an electrolyte solutionsource 186 of the electrochemical deposition system 100. Electrolytesolution 110 can be supplied into the space between the build plate 102and the deposition anode array 113 (e.g., into a partially enclosedcontainer that at least partially houses the build plate 102 and thedeposition anode array 113). In this manner, electrolyte solution 110can be supplied from locations other than from around an outer peripheryof the build plate 102. The electrolyte solution outlet 197 isfluidically coupled with an electrolyte solution receiver 188 of theelectrochemical deposition system 100. Electrolyte solution 110 can beremoved from the space between the build plate 102 and the depositionanode array 113 (e.g., out of a partially enclosed container that atleast partially houses the build plate 102 and the deposition anodearray 113). In this manner, electrolyte solution 110 can be removed fromlocations other than from around an outer periphery of the build plate102. In certain examples, the build plate 102 includes one or moreelectrolyte solution inlets 185 or one or more electrolyte solutionoutlets 197. However, in certain examples, the build plate 102 includesboth one or more electrolyte solution inlets 185 and one or moreelectrolyte solution outlets 197 that are separate from each other. But,in other examples, one channel 183 can be selectively operable tofunction as both an electrolyte solution inlet, in one mode, and anelectrolyte solution outlet, in another mode, via selective operation ofa fluidic valve. Also, in some examples, the electrolyte solution source186 and the electrolyte solution receiver 188 are the same feature.

For a build plate 102 that has a cathode portion 120 with a conductivesurface 131 that is patterned prior to prior to deposition of materialonto the build plate 102, the processor 122 of the electrochemicaldeposition system 100 can include a position-registration module. Theposition-registration module is configured to register the position ofthe conductive surface 131 (e.g., material deposition targets on theconductive surface 131), relative to the build plate 102 and relative tothe deposition anodes 111 of the deposition anode array 113.Registration of the position of the conductive surface 131 can beperformed in advance of the manufacturing of the build plate 102 basedon models and predictions. Additionally, or alternatively, registrationof the position of the conductive surface 131 can be performed after themanufacturing of the build plate 102 based on scanning and/or measuringthe build plate 102.

Referring now to FIG. 14 , according to some examples, transmitting theelectrical energy through the deposition anode 111 of block 406 of themethod 400, and transmitting the electrical energy from the depositionanode 111 through the electrolyte solution 110, to the conductivesurface 131 of the cathode portion 120 of the build plate 102 of block408 of the method 400, includes selectively connecting the conductivelayer 302 of the build plate 102 to the electrical power source 119.With the electrical power source 119 electrically connected to thedeposition anode array 113, selectively connecting the conductive layer302 of the build plate 102 to the electrical power source 119 causes theelectrical energy to transmit through the deposition anode 111 and fromthe deposition anode 111 to the conductive surface 131 of the cathodeportion 120. In other words, selectively connecting the conductive layer302 of the build plate 102 to the electrical power source 119 closes theelectrical circuit between the deposition anode array 113 and theconductive layer 302 so that the material 130 can be deposited onto theconductive layer 302. In some examples, where the conductive layer 302includes multiple conductive-layer segments 302A, which are electricallyisolated from each other, the method 400 can include separately andindependently selectively connecting each one of the plurality ofconductive-layer segments 302A to cause the electrical energy totransmit through corresponding ones of the plurality of depositionanodes 111 and from the corresponding ones of the plurality ofdeposition anodes 111 to corresponding ones of the plurality ofconductive-layer segments 302A such that the material 130 is depositedonto the corresponding ones of the plurality of conductive-layersegments 302A.

Selectively connecting the conductive layer 302 or conductive-layersegments 302A can be facilitated by cathode deposition control circuits117. The cathode deposition control circuits 117 are electricallyconnected to a negative terminal of the electrical power source 119 andare selectively operable to electrically connect the negative terminalof the electrical power source 119 to the conductive layer 302 toinitiate the flow of electrical current from the deposition anode array113 to the cathode portion 120 of the build plate 102.

In some example, the positive terminal of the electrical power source119 is non-selectively electrically connected to the deposition anodearray 113, such that the flow of electrical current from the depositionanode array 113 to the cathode portion 120 of the build plate 102 iscontrolled exclusively by the cathode deposition control circuits 117and selective electrical connection between the conductive layer 302 andthe negative terminal of the electrical power source 119. However, otherexamples, the positive terminal of the electrical power source 119 isselectively electrically connected to the deposition anode array 113,such as via selective operation of the deposition control circuits 115.In these examples, when both the conductive layer 302 of the build plate102 and the deposition anode array 113 are selectively connected to theelectrical power source 119, the electrical energy is transmittedthrough one or more of the deposition anodes 111 of the deposition anodearray 113 and from the deposition anodes 111 to the conductive layer 302of the build plate 102.

Referring to FIGS. 16A and 16B, in some examples, the build plate 102 isa pre-existing or pre-used part, made of a conductive material, that hasa worn portion 350 from which material has been worn away or removedduring use of the part. In such examples, the worn portion 350 definesthe cathode portion 120 and the conductive surface 131. In operation,the material 130 deposited onto the conductive surface 131 replaces theworn or removed material, such that the pre-used part is substantiallyrestored.

Referring to FIGS. 17A and 17B, in some examples, the build plate 102includes an excess material portion 360. The material 130 is depositedonto the cathode portion 120 of the build plate 102. The material 130deposited onto the cathode portion 120 can be adjoined to or spacedapart from excess material portion 360. In one example, the excessmaterial portion 360 at least partially supported the material 130 as itis deposited onto the cathode portion 120. After the material 130 isdeposited onto the cathode portion 120, the excess material portion 360can be removed, using any of various removal tools or processes, asshown in FIG. 17B.

Referring now to FIG. 18A, according to another example, a build plate102 includes a non-conductive substrate 300 and a conductive layer 302on the surface of the non-conductive substrate 300. Example build platesinclude rigid printed circuit boards, flexible printed circuit boards,semiconductor wafers, semiconductor wafer dies, patterned conductivefoils, and the like. The conductive layer 302 is applied onto, or formedin, the non-conductive substrate 300 prior to an electrochemicaldeposition process. More specifically, the conductive layer 302 ispatterned according to a predetermined pattern of one or moreconductive-layer segments. The pattern of the conductive layer 302corresponds with a component at least partially formed by the material130 deposited onto the one or more conductive-layer segments.Accordingly, the pattern of the conductive layer 302 can help define thecomponent (e.g., a pattern of the component). The component forms partof or an entirety of a finished product.

In some examples, the conductive layer 302 includes one conductive-layersegment or multiple conductive-layer segments that are electricallyisolated from each other by a dielectric. In FIG. 18A, the conductivelayer 302 includes a first conductive-layer segment 302A and a secondconductive-layer segment 302B, separated from each other by a dielectriclayer 306. In the illustrated example, each one of the firstconductive-layer segment 302A and the second conductive-layer segment302B is a thin layer of conductive material (such as a thin elongatedstrip of electrically conductive material (e.g., a traditional trace,pad, etc. of a printed circuit board) that defines a predeterminedpattern for deposited material. According to certain examples, thepredetermined pattern is associated with a particular functionalityenabled by the deposited material, when deposited according to thepredetermined pattern.

In the example of FIG. 18A, the predetermined pattern corresponds withan interleaved capacitor. The first conductive-layer segment 302Aincludes multiple first parallel portions 320A interconnected togetherby a first bridge portion 324A. Similarly, the second conductive-layersegment 302B includes multiple second parallel portions 320Binterconnected together by a second bridge portion 324B. Each one ofsome of the first parallel portions 320A is interposed between twoadjacent ones of some of the second parallel portions 320B.Correspondingly, each one of some of the second parallel portions 320Bis interposed between two adjacent ones of some of the first parallelportions 320A. The first conductive-layer segment 302A also includes afirst terminal portion 322A connected to the first bridge portion 324Aand the second conductive-layer segment 302B also includes a secondterminal portion 322B connected to the second bridge portion 324B. Theparallel portions in the Figures are shown as linear, but otherconfigurations including zig zag, curved, etc. may be used. In certainexamples, the predetermined pattern can correspond with any of varioustypes of electrical or non-electrical components. Example mechanicalcomponents include parts such as alignment components, mountingcomponents, heat sink components, etc. Example electrical componentsinclude capacitors, resistors, antenna elements, etc. Exampleelectromechanical components include connectors, MEMS, etc.

The dielectric layer 306 in the example of FIG. 18A includes theelectrically non-conductive material of the non-conductive substrate300. More specifically, the electrically non-conductive material of thenon-conductive substrate 300 extends between the first conductive-layersegment 302A and the second conductive-layer segment 302B, so as toelectrically isolate the first conductive-layer segment 302A and thesecond conductive-layer segment 302B from each other. Additionally, theair (e.g., gas) or vacuum between the first conductive-layer segment302A and the second conductive-layer segment 302B also acts as adielectric to electrically isolate the first conductive-layer segment302A and the second conductive-layer segment 302B from each other.

After the conductive layer 302 is applied onto the non-conductivesubstrate 300, the conductive layer 302 is submersed in the electrolytesolution 110 and the electrochemical deposition system 100 is operatedto deposit a layer of the material 130 onto only the firstconductive-layer segment 302A and the second conductive-layer segment302B. In this manner, the layer of the material 130 deposited onto thefirst conductive-layer segment 302A and the second conductive-layersegment 302B has the same shape (e.g., pattern) as or a shape similar tothe first conductive-layer segment 302A and the second conductive-layersegment 302B. Moreover, because the first conductive-layer segment 302Aand the second conductive-layer segment 302B are electrically isolatedfrom each other, the layer of the material 130 applied onto the firstconductive-layer segment 302A is electrically isolated from the layer ofthe material 130 applied onto the second conductive-layer segment 302B.The same process can be followed to electrochemically deposit multiplelayers of the material 130 onto each other until a desired thickness Tof the material 130 is achieved. In some examples, the desired thicknessT corresponds with a desired performance characteristic of a finishedproduct 200 (see, e.g., FIG. 18B).

According to some examples of using the electrochemical depositionsystem 100 to deposit the material 130 onto one or more conductive-layersegments of the conductive layer 302 of the build plate 102, the buildplate 102 is positioned into the electrolyte solution 110 so that theconductive layer 302 directly contacts the electrolyte solution 110. Thedeposition anode array 113 is also positioned into the electrolytesolution 110 so that the deposition anode array 113 directly contactsthe electrolyte solution 110 and so that the gap 133 is establishedbetween the one or more conductive-layer segments and the depositionanode array 113. One or more of the conductive-layer segments and one ormore of the deposition anodes 111 of the deposition anode array 113 areelectrically connected to the power source 119. Then, electrical energyfrom the power source 119 is transmitted through the one or more of thedeposition anodes 111 that corresponds with at least a portion of thepattern formed by the one or more conductive-layer segments, through theelectrolyte solution 110, and to the one or more of the conductive-layersegments. The transmission of electrical energy in this manner causesthe material 130 to be deposited onto the one or more conductive-layersegments to form at least a portion of a component, which as definedabove, can be an electrical, mechanical, or electromechanical component.This process can be repeated to deposit additional layers of thematerial 130 onto one or more previously deposited layers to increase athickness of the material 130 on the conductive-layer segments.

In some examples, the first conductive-layer segment 302A and the secondconductive-layer segment 302B are temporarily electrically connectedwhen the material 130 is applied, so that the material 130 can beapplied synchronously onto the first conductive-layer segment 302A andthe second conductive-layer segment 302B. After the material depositionprocess is complete, the temporary electrical connection between thefirst conductive-layer segment 302A and the second conductive-layersegment 302B can be removed so that the layer(s) of the material 130applied onto the first conductive-layer segment 302A are electricallyisolated from the layer(s) of the material 130 applied onto the secondconductive-layer segment 302B.

In alternative examples, the first conductive-layer segment 302A and thesecond conductive-layer segment 302B are separately or independentlyelectrically connected to the power source 119. In this manner,electrical power can be supplied to the first conductive-layer segment302A and the second conductive-layer segment 302B asynchronously so thatdeposition of the material 130 is applied onto the firstconductive-layer segment 302A and the second conductive-layer segment302B in an asynchronous manner.

According to some examples, the spacing between adjacentconductive-layer segments corresponds with the size of each one ofdeposition anodes 111 of the deposition anode array 113. For example,the spacing between adjacent conductive-layer segments can be equal tothe width of a deposition anode 111. However, as presented above, theelectrochemical deposition process of the present disclosure enables thematerial 130 to be deposited in a lateral direction, to form overhangportions of the material 130. In this manner, spacing betweenconductive-layer segments can be less a width of a deposition anode 111by forming one or more overhang portions between the conductive-layersegments.

The deposition anodes 111 of the deposition anode array 113 areselectively activated according to the location of the deposition anodes111 relative to the conductive-layer segments. For example, only thoseof the deposition anodes 111 that align with (e.g., are verticallyoffset from) or form the same predetermined pattern as theconductive-layer segments are activated. In other words, the depositionanodes 111 that are selectively activated form a pattern matching thepattern of the conductive-layer segments. This ensures the material 130is deposited onto the conductive-layer segments in a precise andefficient manner. In some examples, the predetermined pattern ofconductive-layer segments is uploaded to or accessed by the controller122, which controls activation of the deposition anodes 111 accordingly.However, in certain examples, the predetermined pattern is not uploadedor accessed by the controller 122 prior to depositing the material 130,such as when the predetermined pattern is not known in advance. In theseexamples, the sensors 123 of the electrochemical deposition system 100includes one or more sensors that senses the pattern of conductive-layersegments. Then, in response to a sensed pattern of conductive-layersegments received by the one or more sensors, the controller 122controls activation of the deposition anodes 111.

Referring to FIG. 18B, the finished product 200 is a capacitor 305. Inthe particular example of FIG. 18B, the capacitor 305 is an interleavedcapacitor having multiple interleaved plates. More specifically, thematerial 130 deposited onto the first parallel portions 320A formsmultiple first plates 130A, spaced apart from each other, the material130 deposited onto the first bridge portion 324A forms a first bridgeplate 330A, and the material 130 deposited onto the first terminalportion 322A forms a first terminal 340A of the capacitor 305.Similarly, the material 130 deposited onto the second parallel portions320B forms multiple second plates 130B, spaced apart from each other,the material 130 deposited onto the second bridge portion 324B forms asecond bridge plate 330B, and the material 130 deposited onto the secondterminal portion 322B forms a second terminal 340B of the capacitor 305.The first bridge plate 330A and the second bridge plate 330B can help tostiffen the first plates 130A and the second plates 130B, respectively.In alternative examples, the electrochemical deposition process can becontrolled so that no material, or a limited quantity of material, isdeposited onto the first bridge portion 324A, the first terminal portion322A, the second bridge portion 324B, and/or the second terminal portion322B.

Each one of some of the first plates 130A is interposed between twoadjacent ones of some of the second plates 130B. Correspondingly, eachone of some of the second plates 130B is interposed between two adjacentones of some of the first plates 130A. Each one of the first plates 130Aeffectively forms a capacitor with a corresponding one of the secondplates 130B. Accordingly, the capacitor 305 illustrated in FIG. 18B, ineffect, includes eight capacitors. The capacitance of each one of thecapacitors, and thus the overall capacitance of the capacitor 305,depends on the thickness T of the interleaved plates and thus number oflayers of the material 130 electrochemically deposited onto theconductive-layer segments. In some examples, controller 122 deposits thematerial 130 so that the thickness T corresponds with a predeterminedthickness associated with a desired capacitance. However, in otherexamples, the sensors 123 include a capacitance meter, which iselectrically coupled with the first plates 130A and the second plates130B and measures the capacitance of the capacitor 305 as the capacitor305 is formed. In such examples, the controller 122 can be configured tocontinue to deposit layers of the material 130 until a desiredcapacitance (e.g., predetermined threshold), as sensed by thecapacitance meter, is reached.

In some examples, the controller 122 is configured to modulate thedeposit of material onto the first parallel portions 320A and/or thesecond parallel portions 320B so that the thickness T of the firstplates 130A and/or the second plates 130B, and thus the capacitance ofcorresponding capacitors, are different. For example, first ones of thefirst plates 130A and second plates 130B can have a thickness differentthan second ones of the first plates 130A and the second plates 130B sothat the capacitance of the capacitor formed by the first ones of thefirst plates 130A and the second plates 130B is different than thecapacitance of the capacitor formed by the second ones of the firstplates 130A and the second plates 130B. The thickness of a plate can bechanged by adjusting the thickness of one or more layers, and/orchanging the quantity of layers forming the plate.

Referring now to FIG. 19 , according to another example, the build plate102 includes a conductive layer 302, but does not include anon-conductive substrate 300. In some examples, the conductive layer 302is a thin sheet or foil that is patterned according to a predeterminedpattern of one or more conductive-layer segments. The conductive layer302 can be rigid, so that conductive layer 302 is self-supporting.However, in some examples, the conductive layer 302 can be placed on andsupported by a support plate during an electrochemical depositionprocess. In some examples, the conductive layer 302 includes multipleconductive-layer segments that are electrically isolated from each otherby a dielectric. In FIG. 19 , similar to the conductive layer 302 ofFIG. 18A, the conductive layer 302 includes a first conductive-layersegment 302A and a second conductive-layer segment 302B, separated fromeach other by a dielectric layer 306. According to certain examples, thepredetermined pattern of the conductive layer 302 is associated with aparticular functionality enabled by the deposited material, whendeposited according to the predetermined pattern. Like the example ofFIG. 18A, in the example of FIG. 19 , the predetermined patterncorresponds with an interleaved capacitor. However, in other examples,the predetermined pattern can correspond with any of various types ofelectrical or non-electrical components.

Unlike the example of FIG. 18A, the build plate 102 of FIG. 19 does notinclude a solid non-conductive substrate or a dielectric layer. Rather,in FIG. 19 , a gap (e.g., air, gas, vacuum, etc.) between the firstconductive-layer segment 302A and the second conductive-layer segment302B acts as a dielectric that electrically isolates the firstconductive-layer segment 302A from the second conductive-layer segment302B. More specifically, the gap provides sufficient electricalisolation between the first conductive-layer segment 302A and the secondconductive-layer segment 302B so that the material 130 can be depositedonto the first conductive-layer segment 302A and the secondconductive-layer segment 302B in the same manner as described above withregards to FIGS. 18A and 18B.

In some examples, the conductive layer 302 can be patterned, to createconductive-layer segments having patterns similar to those describedherein, by utilizing a patterned mask. The patterned mask can be appliedonto an electrically conductive base, which acts as the conductive layer302 of the build plate 102. Moreover, the patterned mask includesthrough-apertures patterned according to a desired pattern ofconductive-layer segments. The patterned mask is made of an electricallynon-conductive material so that when electrical energy is transmittedthrough the deposition anode array 113, through the electrolyte solution110, and to the conductive layer 302, the material 130 iselectrochemically deposited onto only the portions of the conductivelayer 302 exposed by the through-apertures. In this manner, the material130 deposited onto the conductive layer 302 forms a patterncorresponding with the pattern defined by the through-apertures.

Referring to FIG. 20A, according to another example, a build plate 102includes a non-conductive substrate 300 and a conductive layer 302 onthe surface of the non-conductive substrate 300. The build plate 102 ofFIG. 20A, which includes a first conductive-layer segment 302A and asecond conductive-layer segment 302B is similar to the build plate 102of FIG. 18A. For example, each one of the first conductive-layer segment302A and the second conductive-layer segment 302B defines apredetermined pattern for deposited material that is associated with aparticular functionality enabled by the deposited material. However,instead of an interleaved capacitor, in the example of FIG. 20A, thepredetermined pattern corresponds with a resistor. Accordingly, thefirst conductive-layer segment 302A includes a first wall portion 342Athat is parallel to and spaced apart from a second wall portion 342B ofthe second conductive-layer segment 302B, so that a gap 309 (e.g., well)is defined between the first wall portion 342A and the second wallportion 342B. Additionally, the first conductive-layer segment 302Aincludes a first terminal portion 322A connected to the first wallportion 342A, and the second conductive-layer segment 302B includes asecond terminal portion 322B connected to the second wall portion 342B.

Similar to the process described above in relation to FIG. 18B, layersof the material 130 are electrochemically deposited onto theconductive-layer segments of FIG. 20A until a desired thickness T of thematerial 130 is achieved. Referring to FIG. 20B, the finished product200 is a resistor 307. More specifically, the material 130 depositedonto the first wall portion 342A forms a first wall 350A and thematerial 130 deposited onto the second wall portion 342B forms a secondwall 350B, spaced apart from each other by the gap 309. Additionally,the material 130 deposited onto the first terminal portion 322A forms afirst terminal 340A and the material 130 deposited onto the secondterminal portion 322B forms a second terminal 340B, spaced apart fromeach other by the gap 309. After the first wall 350A and the second wall350B are formed, an electrically resistive material 308 is depositedinto the gap 309 defined between the first wall 350A and the second wall350B. In this manner, the first wall 350A and the second wall 350B actas containment walls for containing the electrically resistive material308 therebetween. The resistance of the resistor 307 depends on theelectrical resistivity of the electrically resistive material 308 andthe thickness of the electrically resistive material 308, which can be afunction of the desired thickness T.

Alternatively, as shown in FIG. 20A, in some examples, the predeterminedpattern of the conductive layer 302 includes a pair of thirdconductive-layer segments 303. Each one of the third conductive-layersegments 303 is proximate and electrically isolated from correspondingends of the first conductive-layer segment 302A and the secondconductive-layer segment 302B. More specifically, each one of the thirdconductive-layer segments 303 extends across a portion of the gap 309,within the gap 309 or, as shown, adjacent to the gap 309. When thematerial 130 is electrochemically deposited onto the thirdconductive-layer segments 303, corresponding walls are formed, which canhelp contain the electrically resistive material 308 within the gap 309.In other words, the first wall 350A and the second wall 350B help tocontain the electrically resistive material 308 along sides of the gap309 and the walls formed on the third conductive-layer segments 303 helpcontain the electrically resistive material 308 along the ends of thegap 309.

Referring to FIG. 21 , according to other examples, the finished product200 is a resistor 309. Like the resistor 307 of FIG. 20B, in certainexamples, the resistor 309 can be formed from a build plate similar tothe build plate 102 of FIG. 20A. However, instead of depositingelectrically resistive material 308 between opposing walls made of thematerial 130 to create the electrical resistivity of the resistor, aswith the resistor 307, the electrical resistivity of the resistor 309 iscreated by electrochemically depositing a material 360, which has anelectrical resistance corresponding with a desired electrical resistanceof the resistor 309, between the first terminal portion 322A and thesecond terminal portion 322B. In some examples, the material 130 is notdeposited onto the first terminal portion 322A and the second terminalportion 322B, such that the deposited material does not form a firstterminal 340A or a second terminal 340B. In some examples, the material360 is deposited onto the first wall portion 342A and the second wallportion 342B of the first conductive-layer segment 302A and the secondconductive-layer segment 302B, respectively. Additional portions of thematerial 360 are then deposited as overhang portions until the material360 deposited on the first wall portion 342A is electrically connectedto the material 360 deposited on the second wall portion 342B.

In one example, the resistivity of the material 360 is controlled byselecting an electrolyte solution that results in charged metal ions, inthe electrolyte solution and having a particular electrical resistivity(e.g., a particular limited conductivity), being deposited onto thebuild plate 102. Alternatively, in the same or other examples, theresistivity of the material 360 is controlled by controlling the densityof the material 360 deposited onto the build plate 102. The density ofthe material 360 can be controlled by controlling the characteristics(e.g., timing, intensity, etc.) of the activation of the depositionanodes 111. According to some examples, the sensors 123 include aresistance meter, which is electrically coupled with the first terminal340A and the second terminal 340B. The resistance meter measures theresistance of the resistor 309 as the resistor 309 is formed. In suchexamples, the controller 122 can be configured to continue to depositlayers of the material 360 until a desired resistance, as sensed by theresistance meter, is reached.

The electrochemical deposition system 100 and associated method of usingthe system to make a finished product can help simplify the fabricationof a finished product that includes an electrically-conductive base withone or more electrically-conductive elements on theelectrically-conductive base, where the electrically-conductive base issubstantially larger than the one or more electrically-conductiveelements. According to conventional methods, the electrically-conductivebase is electrochemically deposited onto a conductive surface and thenthe one or more electrically-conductive elements are electrochemicallydeposited onto the base. To simplify the process, theelectrically-conductive base can be formed in a separate process, otherthan an electrochemical deposition process, and supplied to theelectrochemical deposition system 100 as the build plate 102. Theelectrochemical deposition system 100 then electrochemically depositsmaterial onto the separately and previously formedelectrically-conductive base.

It is also recognized that the fabrication of the finished products 200using the electrochemical deposition system 100 can incorporate one ormore additional components to form a resulting circuit. The resultingcircuit can be tested after the finished product is completed or whilethe finished product is being fabricated.

Other features and steps of the electrochemical deposition system 100and the method 400, respectively, can be found in U.S. patentapplication Ser. No. 17/112,909, filed December 2020, which isincorporated herein by reference in its entirety.

In the above description, certain terms may be used such as “up,”“down,” “upper,” “lower,” “horizontal,” “vertical,” “left,” “right,”“over,” “under” and the like. These terms are used, where applicable, toprovide some clarity of description when dealing with relativerelationships. But, these terms are not intended to imply absoluterelationships, positions, and/or orientations. For example, with respectto an object, an “upper” surface can become a “lower” surface simply byturning the object over. Nevertheless, it is still the same object.Further, the terms “including,” “comprising,” “having,” and variationsthereof mean “including but not limited to” unless expressly specifiedotherwise. An enumerated listing of items does not imply that any or allof the items are mutually exclusive and/or mutually inclusive, unlessexpressly specified otherwise. The terms “a,” “an,” and “the” also referto “one or more” unless expressly specified otherwise. Further, the term“plurality” can be defined as “at least two.” Moreover, unless otherwisenoted, as defined herein a plurality of particular features does notnecessarily mean every particular feature of an entire set or class ofthe particular features.

Additionally, instances in this specification where one element is“coupled” to another element can include direct and indirect coupling.Direct coupling can be defined as one element coupled to and in somecontact with another element. Indirect coupling can be defined ascoupling between two elements not in direct contact with each other, buthaving one or more additional elements between the coupled elements.Further, as used herein, securing one element to another element caninclude direct securing and indirect securing. Additionally, as usedherein, “adjacent” does not necessarily denote contact. For example, oneelement can be adjacent another element without being in contact withthat element.

As used herein, the phrase “at least one of”, when used with a list ofitems, means different combinations of one or more of the listed itemsmay be used and only one of the items in the list may be needed. Theitem may be a particular object, thing, or category. In other words, “atleast one of” means any combination of items or number of items may beused from the list, but not all of the items in the list may berequired. For example, “at least one of item A, item B, and item C” maymean item A; item A and item B; item B; item A, item B, and item C; oritem B and item C. In some cases, “at least one of item A, item B, anditem C” may mean, for example, without limitation, two of item A, one ofitem B, and ten of item C; four of item B and seven of item C; or someother suitable combination.

Unless otherwise indicated, the terms “first,” “second,” etc. are usedherein merely as labels, and are not intended to impose ordinal,positional, or hierarchical requirements on the items to which theseterms refer. Moreover, reference to, e.g., a “second” item does notrequire or preclude the existence of, e.g., a “first” or lower-numbereditem, and/or, e.g., a “third” or higher-numbered item.

As used herein, a system, apparatus, structure, article, element,component, or hardware “configured to” perform a specified function isindeed capable of performing the specified function without anyalteration, rather than merely having potential to perform the specifiedfunction after further modification. In other words, the system,apparatus, structure, article, element, component, or hardware“configured to” perform a specified function is specifically selected,created, implemented, utilized, programmed, and/or designed for thepurpose of performing the specified function. As used herein,“configured to” denotes existing characteristics of a system, apparatus,structure, article, element, component, or hardware which enable thesystem, apparatus, structure, article, element, component, or hardwareto perform the specified function without further modification. Forpurposes of this disclosure, a system, apparatus, structure, article,element, component, or hardware described as being “configured to”perform a particular function may additionally or alternatively bedescribed as being “adapted to” and/or as being “operative to” performthat function.

The schematic flow chart diagram included herein is generally set forthas logical flow chart diagram. As such, the depicted order and labeledsteps are indicative of one example of the presented method. Other stepsand methods may be conceived that are equivalent in function, logic, oreffect to one or more steps, or portions thereof, of the illustratedmethod. Additionally, the format and symbols employed are provided toexplain the logical steps of the method and are understood not to limitthe scope of the method. Although various arrow types and line types maybe employed in the flow chart diagrams, they are understood not to limitthe scope of the corresponding method. Indeed, some arrows or otherconnectors may be used to indicate only the logical flow of the method.For instance, an arrow may indicate a waiting or monitoring period ofunspecified duration between enumerated steps of the depicted method.Additionally, the order in which a particular method occurs may or maynot strictly adhere to the order of the corresponding steps shown.Blocks represented by dashed lines indicate alternative operationsand/or portions thereof. Dashed lines, if any, connecting the variousblocks represent alternative dependencies of the operations or portionsthereof. It will be understood that not all dependencies among thevarious disclosed operations are necessarily represented.

Many of the functional units described in this specification have beenlabeled as modules, in order to more particularly emphasize theirimplementation independence. For example, a module may be implemented asa hardware circuit comprising custom VLSI circuits or gate arrays,off-the-shelf semiconductors such as logic chips, transistors, or otherdiscrete components. A module may also be implemented in programmablehardware devices such as field programmable gate arrays, programmablearray logic, programmable logic devices or the like.

Modules may also be implemented in code and/or software for execution byvarious types of processors. An identified module of code may, forinstance, comprise one or more physical or logical blocks of executablecode which may, for instance, be organized as an object, procedure, orfunction. Nevertheless, the executables of an identified module need notbe physically located together, but may comprise disparate instructionsstored in different locations which, when joined logically together,comprise the module and achieve the stated purpose for the module.

Indeed, a module of code may be a single instruction, or manyinstructions, and may even be distributed over several different codesegments, among different programs, and across several memory devices.Similarly, operational data may be identified and illustrated hereinwithin modules, and may be embodied in any suitable form and organizedwithin any suitable type of data structure. The operational data may becollected as a single data set, or may be distributed over differentlocations including over different computer readable storage devices.Where a module or portions of a module are implemented in software, thesoftware portions are stored on one or more computer readable storagedevices.

Any combination of one or more computer readable medium may be utilized.The computer readable medium may be a computer readable storage medium.The computer readable storage medium may be a storage device storing thecode. The storage device may be, for example, but not limited to, anelectronic, magnetic, optical, electromagnetic, infrared, holographic,micromechanical, or semiconductor system, apparatus, or device, or anysuitable combination of the foregoing.

More specific examples (a non-exhaustive list) of the storage devicewould include the following: an electrical connection having one or morewires, a portable computer diskette, a hard disk, a random access memory(RAM), a read-only memory (ROM), an erasable programmable read-onlymemory (EPROM or Flash memory), a portable compact disc read-only memory(CD-ROM), an optical storage device, a magnetic storage device, or anysuitable combination of the foregoing. In the context of this document,a computer readable storage medium may be any tangible medium that cancontain, or store a program for use by or in connection with aninstruction execution system, apparatus, or device.

Code for carrying out operations for examples may be written in anycombination of one or more programming languages including anobject-oriented programming language such as Python, Ruby, Java,Smalltalk, C++, or the like, and conventional procedural programminglanguages, such as the “C” programming language, or the like, and/ormachine languages such as assembly languages. The code may executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer may be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection may be made to anexternal computer (for example, through the Internet using an InternetService Provider).

The described features, structures, or characteristics of the examplesmay be combined in any suitable manner. In the above description,numerous specific details are provided, such as examples of programming,software modules, user selections, network transactions, databasequeries, database structures, hardware modules, hardware circuits,hardware chips, etc., to provide a thorough understanding of examples.One skilled in the relevant art will recognize, however, that examplesmay be practiced without one or more of the specific details, or withother methods, components, materials, and so forth. In other instances,well-known structures, materials, or operations are not shown ordescribed in detail to avoid obscuring aspects of an example.

Aspects of the examples are described above with reference to schematicflowchart diagrams and/or schematic block diagrams of methods,apparatuses, systems, and program products according to examples. Itwill be understood that each block of the schematic flowchart diagramsand/or schematic block diagrams, and combinations of blocks in theschematic flowchart diagrams and/or schematic block diagrams, can beimplemented by code. These code may be provided to a processor of ageneral purpose computer, special purpose computer, or otherprogrammable data processing apparatus to produce a machine, such thatthe instructions, which execute via the processor of the computer orother programmable data processing apparatus, create means forimplementing the functions/acts specified in the schematic flowchartdiagrams and/or schematic block diagrams block or blocks.

The code may also be stored in a storage device that can direct acomputer, other programmable data processing apparatus, or other devicesto function in a particular manner, such that the instructions stored inthe storage device produce an article of manufacture includinginstructions which implement the function/act specified in the schematicflowchart diagrams and/or schematic block diagrams block or blocks.

The code may also be loaded onto a computer, other programmable dataprocessing apparatus, or other devices to cause a series of operationalsteps to be performed on the computer, other programmable apparatus orother devices to produce a computer implemented process such that thecode which execute on the computer or other programmable apparatusprovide processes for implementing the functions/acts specified in theflowchart and/or block diagram block or blocks.

The schematic flowchart diagrams and/or schematic block diagrams in thefigures illustrate the architecture, functionality, and operation ofpossible implementations of apparatuses, systems, methods and programproducts according to various examples. In this regard, each block inthe schematic flowchart diagrams and/or schematic block diagrams mayrepresent a module, segment, or portion of code, which comprises one ormore executable instructions of the code for implementing the specifiedlogical function(s).

The present subject matter may be embodied in other specific formswithout departing from its spirit or essential characteristics. Thedescribed examples are to be considered in all respects only asillustrative and not restrictive. All changes which come within themeaning and range of equivalency of the claims are to be embraced withintheir scope.

What is claimed is:
 1. An electrochemical additive manufacturing method,comprising steps of: positioning a build plate into an electrolytesolution such that a conductive layer of the build plate directlycontacts the electrolyte solution, wherein the conductive layercomprises at least one conductive-layer segment forming a patterncorresponding with a component; positioning a deposition anode array,comprising a plurality of deposition anodes, into the electrolytesolution such that a gap is established between the at least oneconductive-layer segment and the deposition anode array; connecting theat least one conductive-layer segment to a power source; connecting oneor more deposition anodes of the plurality of deposition anodes to thepower source, wherein the one or more deposition anodes of the pluralityof deposition anodes correspond with at least a portion of the patternformed by the at least one conductive-layer segment; and transmittingelectrical energy from the power source through the one or moredeposition anodes of the plurality of deposition anodes correspondingwith the at least the portion of the pattern formed by the at least oneconductive-layer segment, through the electrolyte solution, and to theat least one conductive-layer segment, such that material is depositedonto the at least one conductive-layer segment and forms at least aportion of the component.
 2. The electrochemical additive manufacturingmethod according to claim 1, wherein the one or more deposition anodesof the plurality of deposition anodes, corresponding with the at leastthe portion of the pattern formed by the at least one conductive-layersegment, form a pattern matching the at least the portion of the patternformed by the at least one conductive-layer segment.
 3. Theelectrochemical additive manufacturing method according to claim 1,wherein the at least one conductive-layer segment comprises an elongatedstrip of electrically conductive material.
 4. The electrochemicaladditive manufacturing method according to claim 1, wherein: theconductive layer comprises multiple conductive-layer segments; and themultiple conductive-layer segments are electrically isolated from eachother via the dielectric layer.
 5. The electrochemical additivemanufacturing method according to claim 4, further comprising:electrically coupling together the multiple conductive-layer segments;and synchronously depositing the material onto the multipleconductive-layer segments.
 6. The electrochemical additive manufacturingmethod according to claim 4, further comprising: connecting a first oneof the multiple conductive-layer segments to the power sourceindependently of a second one of the multiple conductive-layer segments;depositing the material onto the first one of the multipleconductive-layer segments; and depositing the material onto the secondone of the multiple conductive-layer segments; wherein the material isdeposited onto the first one of the multiple conductive-layer segmentsasynchronously relative to the deposition of the material onto thesecond one of the multiple conductive-layer segments.
 7. Theelectrochemical additive manufacturing method according to claim 1,wherein the conductive layer consists of a patterned foil ofelectrically conductive material.
 8. The electrochemical additivemanufacturing method according to claim 1, wherein the build plate is aprinted circuit board comprising a dielectric layer, made of anelectrically insulating material, and the at least one conductive-layersegment.
 9. The electrochemical additive manufacturing method accordingto claim 1, wherein: the build plate comprises a substrate, made of oneof an electrically non-conductive material or a semiconductor material;and the at least one conductive-layer segment is on the substrate. 10.The electrochemical additive manufacturing method according to claim 1,further comprising: transmitting an electrical signal through thematerial after a quantity of the material is deposited onto theconductive-layer segment; sensing a characteristic of the electricalsignal; and depositing an additional quantity of the material onto thequantity of the material in response to a sensed characteristic of theelectrical signal.
 11. The electrochemical additive manufacturing methodaccording to claim 1, further comprising: transmitting an electricalsignal through the material after a quantity of the material isdeposited onto the conductive-layer segment; sensing a characteristic ofthe electrical signal; and depositing additional quantities of thematerial onto the conductive-layer segment until a sensed characteristicof the electrical signal reaches a predetermined threshold.
 12. Theelectrochemical additive manufacturing method according to claim 1,wherein: the component comprises a capacitor; the conductive layercomprises multiple conductive-layer segments; the build plate furthercomprises a dielectric layer; the multiple conductive-layer segments areelectrically isolated from each other; and the material deposited ontothe multiple conductive-layer segments forms two opposing plates of thecapacitor.
 13. The electrochemical additive manufacturing methodaccording to claim 1, wherein: the component comprises a resistor; theconductive layer comprises multiple conductive-layer segments; the buildplate further comprises a dielectric layer; the multipleconductive-layer segments are electrically isolated from each other; thematerial deposited onto the multiple conductive-layer segments forms twoopposing walls of the resistor; and the method further comprisesdepositing an electrically resistive material into a gap defined betweenthe two opposing walls of the resistor.
 14. The electrochemical additivemanufacturing method according to claim 1, wherein: the componentcomprises an electronic sensor component; and the at least oneconductive-layer segment and the material deposited onto the at leastone conductive-layer segment form an electronic sensor component. 15.The electrochemical additive manufacturing method according to claim 14,wherein the electronic sensor component comprises at least one of athermocouple or a strain gauge.
 16. The electrochemical additivemanufacturing method according to claim 1, wherein: the componentcomprises a surface mount technology (SMT) passive component; and thematerial deposited onto the at least one conductive-layer segment formsthe SMT passive component.
 17. The electrochemical additivemanufacturing method according to claim 1, wherein: the conductive layercomprises multiple conductive-layer segments; the build plate furthercomprises a dielectric layer; the multiple conductive-layer segments areelectrically isolated from each other; and the material deposited ontothe multiple conductive-layer segments forms an electrical connectionthat electrically couples together the multiple conductive-layersegments.
 18. The electrochemical additive manufacturing methodaccording to claim 1, wherein: the component comprises a radio-frequency(RF) component; and the material deposited onto the at least oneconductive-layer segment forms the RF component.
 19. An electrochemicaldeposition system for fabricating a manufactured part, comprising: anelectrodeposition cell, configured to hold an electrolytic fluid; abuild plate, comprising a conductive layer that comprises at least oneconductive-layer segment forming a pattern corresponding with acomponent; a deposition anode array, comprising a plurality ofdeposition anodes; a mounting system, configured to position the atleast one conductive-layer segment and the plurality of depositionanodes in direct contact with the electrolytic fluid, such that a gap isestablished between the at least one conductive-layer segment and theplurality of deposition anodes, when the electrolytic fluid is held inthe electrodeposition cell; a power source, configured to create avoltage potential on the at least one conductive-layer segment; apositioning system, configured to control a distance between the atleast one conductive-layer segment and the plurality of depositionanodes; and a controller, configured to control a current field acrossdeposition anodes of the plurality of deposition anodes correspondingwith at least a portion of the pattern formed by the at least oneconductive-layer segment, when the electrodeposition cell holds theelectrolytic fluid and the at least one conductive-layer segment and theplurality of anodes are positioned in direct contact with theelectrolytic fluid, to selectively deposit material onto the at leastone conductive-layer segment to form at least a portion of thecomponent.
 20. The electrochemical deposition system according to claim19, wherein the build plate is a printed circuit board comprising adielectric layer, made of an electrically insulating material, and theat least one conductive-layer segment.
 21. The electrochemicaldeposition system according to claim 19, wherein: the build platecomprises a substrate, made of one of an electrically non-conductivematerial or a semiconductor material; and the at least oneconductive-layer segment is on the substrate.
 22. The electrochemicaldeposition system according to claim 19, wherein the deposition anodesof the plurality of deposition anodes, corresponding with the at leastthe portion of the pattern formed by the at least one conductive-layersegment, form a pattern matching at least the portion of the patternformed by the at least one conductive-layer segment.